Electroplating Pressure Device for Bubble Removal
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Solution Overview
Problem
Conventional electroplating processes suffer from slower plating rates and defects in fine-pitch wires or blind holes due to bubble and impurity entrapment on wafers and circuit boards.
Innovation Solution
An electroplating system incorporating a pressure device with a porous, hydrophilic member that directs electroplating solution through tubes to the object, creating a passage for electric force lines and using conduction holes to enhance material deposition, while spraying solution to wash away bubbles and impurities through first through holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional electroplating process is used, then plating solution can deposit plating material on object, but plating rate is slow and bubbles/impurities remain in fine-pitch wires or blind holes causing plating defects
Solution Approach 1:
The pressure device is divided into multiple functional sections: a first chamber for solution storage, a second chamber for pressurization, and multiple nozzle assemblies distributed across the device bottom. Each nozzle independently directs solution to specific areas, enabling simultaneous treatment of multiple regions including fine-pitch wires and blind holes, thereby increasing overall plating rate while maintaining quality through targeted solution delivery
Solution Approach 2:
The system changes the pressure parameter of the electroplating solution by using a pressurizable second chamber that can increase solution pressure before delivery. This pressure change enables the solution to penetrate into fine-pitch wires and blind holes more effectively, removing bubbles and impurities while maintaining high plating rate and preventing defects
2Productivity
If pressure is applied to increase plating rate, then plating efficiency improves, but bubbles and impurities may be trapped in fine-pitch structures causing defects
Solution Approach 1:
Multiple nozzle assemblies act as intermediary elements between the pressurized solution and the object surface. These nozzles distribute the high-pressure solution in a controlled manner, allowing pressure to reach fine-pitch wires and blind holes effectively while the nozzle structure itself prevents direct trapping of bubbles and impurities, thus maintaining both high efficiency and defect-free plating
Solution Approach 2:
The system employs periodic or pulsed solution delivery through the nozzles, creating cycles of pressure application and release. This periodic action helps to repeatedly flush out bubbles and impurities from fine-pitch structures during the plating process, preventing their permanent entrapment while maintaining overall plating efficiency through sustained material deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system prevents plating defects and enhances efficiency by ensuring uniform deposition of the plating material on the object, effectively addressing the issues of slower plating rates and impurity entrapment.
Implementation Method 1
Since the porous member is made hydrophilic, solution applied through the tubes is absorbed by the porous member and transported away from the object
Implementation Method 2
the porous member is made hydrophilic, solution applied through the tubes is absorbed by the porous member and transported away from the object
Implementation Method 3
the electroplating solution, filled and pressed in the chamber, can spray toward the object through the first through holes and wash the bubbles and/or impurities remained on the object
Implementation Method 4
electric force line formed in the conduction holes and the third through holes provides a benefit for the deposition of the plating material on the object
Implementation Method 5
passage of electric force line formed in the conduction holes and the third through holes
Data Source
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AI summary
An electroplating system for depositing a plating material on an object includes a pressure device and an anode element. The pressure device includes a lid having first and second through holes and a base having a chamber, conduction holes and third through holes located in the chamber. Each of the conduction tubes includes a conduction hole connecting to one of the third through holes. When the lid covers the chamber, the first through holes communicate with the chamber for spraying an electroplating solution toward the object and the second through holes reveal the conduction holes. A passage of electric force line is formed in the conduction holes and the third through holes filled with the electroplating solution, and the anode element is located outside the passage of electric force line. The electroplating system can prevent defective plating and enhance plating efficiency.