Electroplating Regulating Plate for Thickness Uniformity
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Solution Overview
Problem
Electroplating processes often suffer from poor metal coating thickness uniformity due to variations in electric field distribution affected by the substrate's upper film characteristics, leading to uneven metal coating on substrates such as circuit boards.
Innovation Solution
An electroplating apparatus with a regulating plate featuring an insulation grid plate and wires, where a controller adjusts the electromagnetic field around the wires to control the incident angle of electric lines of force, ensuring consistent electric field density across the substrate by managing the Lorentz force interaction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional electroplating is performed without field regulation, then the process is simple and fast, but the metal coating thickness uniformity is poor
Solution Approach 1:
A regulating plate with wires is introduced as an intermediary component between the anode and cathode. This regulating plate modifies the electric field distribution by providing additional wire elements that interact with the electric lines of force, thereby improving metal coating thickness uniformity without fundamentally changing the basic electroplating apparatus structure
Solution Approach 2:
The invention changes the electric field parameters by introducing a regulating plate with adjustable wires. The position and configuration of these wires can be modified to optimize electric field distribution, allowing control over metal coating thickness uniformity while maintaining relatively simple apparatus operation
2Productivity
If the electric lines of force are close to the substrate to be plated, then the electroplating process is efficient, but the electric lines of force are affected by the upper film layer characteristics and turned, resulting in uneven distribution
Solution Approach 1:
The regulating plate provides locally differentiated field regulation through its wire configuration. Different regions of the regulating plate can be adjusted to compensate for local variations caused by upper film layer characteristics, ensuring uniform electric line of force density distribution while maintaining high electroplating efficiency
3Manufacturing precision
If a regulating plate with wires is introduced to control electric field distribution, then the metal coating thickness uniformity is improved, but the device complexity increases
Solution Approach 1:
The regulating plate is segmented into multiple independent wires that can be individually adjusted. This segmentation allows precise control over electric field distribution in different regions, improving electroplating thickness uniformity while keeping each individual wire component simple and the overall structure modular
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively alleviates the issue of poor electroplating thickness uniformity by controlling the number of electric lines of force entering different openings on the substrate, resulting in a consistent metal coating thickness and improved operating freedom.
Implementation Method 1
The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires
Implementation Method 2
After the power supply supplies a power, a plurality of electric lines of force moving from the anode to the cathode are formed
Implementation Method 3
Electroplating has been widely used in various fields. In addition to being traditionally used as a surface treatment method
Implementation Method 4
A metal coating is formed on the substrate to be plated
Data Source
AI summary
An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.