Electroplating Rinse Agent pH Matching Prevents Deposit Formation
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Solution Overview
Problem
The formation of conductive deposits and scale in electrochemical plating equipment leads to frequent maintenance needs, reducing the throughput and efficiency of electroplating processors due to the formation of contaminants and plate-up on seals and electrical contacts.
Innovation Solution
Contacting the residual electroplating solution with a rinse agent having a pH similar to the original solution to maintain solute solubility and prevent precipitation, thereby reducing or eliminating the formation of insoluble deposits on equipment surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If deionized water or rinse chemistries are used after electrochemical plating, then the equipment is cleaned, but contaminants such as organometallics and metallics precipitate and form scale on device structures and seal surfaces
Solution Approach 1:
The patent changes the pH parameter of the rinsate to match the pH of the electroplating solution. This parameter change prevents the precipitation of contaminants by maintaining the chemical conditions that keep metal ions and organometallic compounds in solution, thereby eliminating scale formation on seals and device structures while still achieving effective cleaning
2Ease of operation
If deionized water is used as a rinse agent, then the equipment is rinsed, but conductive deposits form on seals and electrical contacts creating unwanted conductive pathways
Solution Approach 1:
The patent changes the pH parameter of the rinsate to match the electroplating solution's pH, which prevents the formation of conductive deposits. By maintaining the same pH conditions, metal ions remain in solution rather than precipitating as conductive scale on the seal and electrical contacts, thereby preserving electrical insulation and reliability
3Reliability
If frequent cleaning and maintenance of contacts and seal is performed, then deposits are removed, but the electroplating processor is idle and throughput is reduced
Solution Approach 1:
The patent applies preliminary action by using a pH-matched rinsate immediately after electrochemical plating to prevent deposit formation in the first place. This preventive approach eliminates the need for subsequent cleaning operations, allowing the processor to maintain continuous operation and maximize throughput while still ensuring equipment reliability
Solution Approach 2:
The patent enables continuity of useful action by eliminating idle cleaning time. The pH-matched rinsate prevents deposits during the plating process itself, allowing the processor to operate continuously without interruption for maintenance, thereby maximizing productivity while maintaining equipment functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents the formation of conductive pathways and reduces maintenance needs, maintaining equipment life and increasing processing efficiency by ensuring contaminants remain in solution and are easily removed, thus avoiding production interruptions.
Implementation Method 1
contacting surfaces in need thereof with a rinse agent having a predetermined pH suitable for maintaining solute solubility in a rinsate
Data Source
AI summary
Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.