Electroplating Singulated Semiconductor Packages
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Solution Overview
Problem
Conventional electro-plating methods for semiconductor packages fail when packages are singulated, as they lose electrical connectivity, preventing effective plating of individual units.
Innovation Solution
A method and apparatus where singulated semiconductor devices are placed on a non-conductive platform in a plating solution, with movable conductive parts that electrically connect the devices to a cathode, allowing plating particles from an anode to deposit onto the devices, using a container with a plating chemical and an electrical power source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor packages are singulated before electro-plating, then individual packages can be plated separately, but electrical connectivity is lost preventing effective plating
Solution Approach 1:
Conductive parts are introduced as intermediary elements between the singulated semiconductor packages and the cathode. These conductive parts maintain electrical connectivity by serving as mediators that conduct current from the cathode to the package surfaces, enabling electro-plating of individually separated packages without requiring the packages to be electrically connected to each other
Solution Approach 2:
The conductive parts are made movable relative to the semiconductor packages. This dynamic configuration allows the conductive parts to move across and make contact with different package surfaces, ensuring reliable electrical connectivity during the plating process while accommodating the singulated state of individual packages
2Adaptability or versatility
If conventional electro-plating is used on singulated packages, then individual plating is enabled, but plating uniformity and quality deteriorate
Solution Approach 1:
The conductive parts act as intermediaries that distribute electrical current uniformly across the surfaces of singulated packages. By moving these conductive parts across multiple packages, the system ensures consistent current distribution and plating quality, matching the uniformity achieved in conventional strip-based plating methods
Solution Approach 2:
The movement of conductive parts across singulated packages creates a dynamic plating process that ensures uniform current distribution. This motion allows each package surface to receive consistent electrical exposure, maintaining plating quality and uniformity comparable to conventional methods while enabling individual package processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and uniform electro-plating of singulated semiconductor packages, matching the quality of conventional strip-based plating methods, as demonstrated by visual inspection, adhesion, solderability, and whisker test results.
Implementation Method 1
When an electrical current is applied by the electrical power source through the anode 3a and cathode 3b to the anode plate 4 and metal frame 6, the solder particles on the anode plate move (as shown by item 8) through the plating chemical and become plated onto the metal frame (as shown by item 9).
Implementation Method 2
moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode
Data Source
AI summary
A method of plating a plurality of semiconductor devices includes: applying an electrical power source to an anode terminal and a cathode terminal; placing the plurality of semiconductor devices on a non-conductive platform in a plating solution; moving conductive parts across surfaces of the semiconductor devices to be plated, wherein the conductive parts electrically connect the surfaces of the semiconductor devices to the cathode; and wherein plating particles connected to the anode terminal move to and plate the surfaces of the semiconductor devices.