Electroplating Substrate Holder Azimuthal Control

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Solution Overview

Problem

Conventional electroplating systems lack precise control and monitoring of the location on a substrate that first contacts the electroplating solution, leading to variability and stability issues, especially in newer technology nodes with smaller feature sizes, which complicates defect troubleshooting and reduces overall device yield.

Innovation Solution

An electroplating system with a substrate holder that rotates and tilts, featuring a notch alignment feature and a controller for real-time integrated control of vertical and rotational movements, allowing precise positioning of the notch alignment feature relative to a fixed reference ray when the substrate first contacts the electroplating solution, thereby controlling the entry profile and reducing variability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional electroplating systems are used without precise control mechanisms, then the system structure remains simple, but the manufacturing precision and reliability deteriorate due to variability in substrate contact location

Engineering Contradiction:
Improvesubstrate contact location precisionVSAvoidcontrol system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The system performs preliminary actions by tilting the substrate holder before vertical movement and by initiating rotation before substrate entry. The controller calculates a time delay based on real-time rotational status to ensure the notch alignment feature reaches the prescribed azimuthal position before the substrate contacts the electroplating solution, thereby achieving precise contact location control in advance.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The controller continuously monitors the real-time azimuthal position of the notch alignment feature and the real-time rotational status of the substrate holder. Based on this feedback, the controller dynamically adjusts the time delay to initiate vertical movement, ensuring the substrate contacts the electroplating solution at the precise prescribed location despite variations in rotational speed or positioning.

Inventive Principle:
Principle #23Feedback

2Reliability

If real-time integrated control of vertical and rotational movements is implemented, then manufacturing precision and process stability improve, but device complexity and control system requirements worsen

Engineering Contradiction:
Improveprocess stabilityVSAvoidcontrol system integration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The controller merges the control of vertical movement and rotational movement into a single integrated control system. It simultaneously manages the tilt mechanism, rotation mechanism, and lift mechanism, coordinating their operations to achieve precise control of the substrate entry profile and contact location, thereby improving process stability through unified control.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system dynamically adjusts operational parameters in real-time. The controller continuously monitors the azimuthal position and rotational status, then dynamically calculates and adjusts the time delay for initiating vertical movement. This dynamic adaptation ensures consistent contact location control despite variations in rotational speed, tilt angle, or positioning, thereby enhancing process reliability.

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If precise positioning of the notch alignment feature is achieved through real-time control, then manufacturing precision and defect reduction improve, but measurement and detection difficulty worsen

Engineering Contradiction:
Improvecontact location consistencyVSAvoidreal-time position monitoring
Core Design Contradiction:
Manufacturing precisionVSDifficulty of detecting and measuring

Solution Approach 1:

The system replaces complex mechanical measurement and detection mechanisms with a computational approach. The controller uses software algorithms to calculate the prescribed azimuthal position and time delay based on programmed parameters (tilt angle, rotational speed, vertical movement profile) rather than relying on complex mechanical sensors or detectors to measure the exact contact location in real-time.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The controller creates a virtual model or copy of the substrate holder's motion state by continuously tracking the azimuthal position and rotational status through sensors. This virtual representation allows the controller to predict and control the contact location without requiring direct physical measurement of the actual contact point, simplifying the detection and measurement requirements.

Inventive Principle:
Principle #26Copying

Data Source

PatentUS20230245917A1Systems and Methods for Controlling Substrate Approach Toward a Target Horizontal Plane
Publication Date: 2023.08.03 LAM RES CORP
  • US20230245917A1 patent drawing
  • US20230245917A1 patent drawing
  • US20230245917A1 patent drawing

AI summary

A determination is made of a real-time azimuthal position of a notch alignment feature located on a support surface of a substrate holder relative to a fixed reference ray extending perpendicularly away from a rotational axis of the substrate holder as the substrate holder rotates about the rotational axis. A determination is made of an approach initiation azimuthal position of the notch alignment feature relative to the fixed reference ray at which vertical movement of the substrate holder should initiate in order to have the notch alignment feature located at a prescribed azimuthal position relative to the fixed reference ray when the substrate holder reaches a prescribed vertical position. A determination is made of a time delay required to have the notch alignment feature located at the approach initiation azimuthal position. Vertical movement of the substrate holder is initiated in accordance with the determined time delay.