Electroplating Tank Segmentation for Balanced Polishing and Layer Growth
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Solution Overview
Problem
Existing electroplating and polishing processes often struggle to balance the simultaneous performance of electroplating and polishing, leading to potential hindrance in plated layer growth due to excessive polishing.
Innovation Solution
An electroplating apparatus with a magnetic rotator that generates an alternating magnetic field, sectioning the tank into two spaces, allowing objects to shift between electroplating and polishing conditions by moving laterally, thereby balancing the processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If electroplating and polishing are performed simultaneously in the same bath, then plated layer adhesion is improved, but plated layer growth is hindered due to excessive polishing
Solution Approach 1:
The tank is divided into a first space for electroplating and a second space for polishing by the magnetic rotator. The magnetic rotator sections the internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. This spatial segmentation allows independent optimization of electroplating and polishing processes without mutual interference.
Solution Approach 2:
The magnetic rotator is movable in a lateral direction intersecting a rotational axis, allowing dynamic adjustment of the space division between electroplating and polishing zones. This enables shifting objects between electroplating condition (in the first space) and polishing condition (in the second space) according to process requirements, providing dynamic control over the balance between plated layer growth and surface finishing.
2Device complexity
If magnetic rotator is stationary, then device structure is simplified, but uniform polishing and electroplating cannot be achieved
Solution Approach 1:
The magnetic rotator is configured to be movable in a lateral direction intersecting its rotational axis. This dynamic capability allows the magnetic rotator to move to different positions to provide uniform polishing action across the entire surface of objects, while maintaining the relatively simple structure of a single rotating component rather than multiple complex mechanisms.
Solution Approach 2:
The magnetic rotator rotates about its axis while also being movable in a lateral direction, creating a periodic motion pattern. This periodic action ensures that all surfaces of objects receive uniform polishing and electroplating treatment over time, as objects are repeatedly exposed to different zones of the magnetic field and mechanical action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates a well-balanced electroplating and polishing process, ensuring uniform plated layer growth and adhesion without excessive polishing, allowing for efficient production of plated objects.
Implementation Method 1
at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field
Implementation Method 2
rotating a magnetic rotator under the electroplating tank so as to move the magnetic media in the electrolyte solution in accordance with magnetic attraction and magnetic repulsion
Implementation Method 3
rotating a magnetic rotator under the electroplating tank so as to move the magnetic media in the electrolyte solution in accordance with magnetic attraction and magnetic repulsion
Implementation Method 4
electroplating to-be-electroplated objects in an electroplating tank that stores an electrolyte solution
Implementation Method 5
electroplating and agitating are simultaneously performed so that plated layers are more firmly adhered to base members
Implementation Method 6
electroplating and agitating are simultaneously performed so that plated layers are more firmly adhered to base members
Data Source
AI summary
Electroplating apparatus includes an electroplating tank that stores an electrolyte solution in which at least objects to be electroplated and magnetic media sink, and at least one magnetic rotator rotatably arranged under the electroplating tank so as to generate an alternating magnetic field. The magnetic rotator is arranged to section an internal space of the electroplating tank into a first space occupying a space above the magnetic rotator and a second space occupying a remaining space other than the first space. The magnetic rotator is arranged to be movable in a lateral direction intersecting a rotational axis of the magnetic rotator, allowing the objects to be shifted between a condition of being present in the electrolyte solution and in the first space and a condition of being present in the electrolyte solution and in the second space.