Electroplating Deposition Control for Uniform Package Substrate Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The uniformity of thickness in circuit layers of semiconductor substrates formed through electroplating is a critical issue, affecting the yield of semiconductor substrates due to varying deposition rates across different regions.
Innovation Solution
A method involving the generation of an electric field between an anode and a cathode in an electroplating solution, where a deposition control apparatus adjusts the deposition rate by blocking or altering the deposition paths of metal ions, ensuring a consistent thickness by equalizing electric charge densities across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electroplating is used to form circuit layers on semiconductor substrates, then the substrate can be manufactured with electrical connections, but the thickness uniformity of the plated layer deteriorates due to varying deposition rates across different regions
Solution Approach 1:
The patent applies local quality by introducing a deposition control apparatus with region-specific control. The apparatus divides the substrate into multiple regions (central and outer regions) and applies different deposition control strategies to each region. The control apparatus includes multiple deposition control units positioned at different locations to independently adjust deposition parameters for different regions, thereby achieving uniform thickness across the entire substrate despite varying local deposition rates
Solution Approach 2:
The patent employs parameter changes by dynamically adjusting deposition parameters (such as current density, voltage, or deposition time) for different regions of the substrate during the electroplating process. The deposition control apparatus modifies these parameters in real-time based on the specific requirements of each region, allowing the central region and outer regions to receive optimized deposition conditions that compensate for their different inherent deposition rates
2Productivity
If the deposition rate is increased to improve manufacturing efficiency, then productivity improves, but the uniformity of thickness deteriorates
Solution Approach 1:
The patent applies dynamics by implementing a dynamic deposition control system that can adjust deposition parameters during the manufacturing process. The deposition control apparatus continuously monitors and modifies deposition conditions for different regions in real-time, transitioning from a static to a dynamic control approach. This allows the system to maintain high productivity while ensuring uniform thickness by adapting parameters as the deposition progresses and regional differences manifest
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures a uniform thickness of the plated layer, enhancing the yield of semiconductor substrates by reducing the difference in deposition rates between central and outer regions, thereby improving the manufacturing process.
Implementation Method 1
generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode
Data Source
AI summary
A method for manufacturing a package includes generating an electric field between an anode and a cathode in an electroplating solution to electroplate a substrate electrically connected to the cathode; depositing metal on a central region of the substrate with a first deposition rate; depositing metal on an outer region of the substrate with a second deposition rate lower than the first deposition rate; and reducing the first deposition rate.