Electroplating Condition Search for In-Plane Film Uniformity
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Solution Overview
Problem
Achieving high in-plane uniformity of plating films on substrates during electroplating is challenging due to the terminal effect, where the plating layer becomes thin at the center and thick at the periphery, and existing methods require trial-and-error adjustments of various parameters, making it difficult to select suitable conditions for optimal results.
Innovation Solution
A plating support system that includes a simulator to predict in-plane uniformity based on assumed conditions, a storage unit for numerical analysis data, and an analysis unit that uses regression or machine learning to estimate models and search for recommended implement conditions, facilitating the determination of optimal parameters for improved uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If blocking components or anode masks are used to control electric field distribution, then in-plane uniformity of plating film is improved, but device complexity increases
Solution Approach 1:
The patent introduces an intermediate mask positioned between the anode and substrate as a mediator to control electric field distribution. This intermediate component modifies the electric field without requiring direct modification of the anode or substrate, thereby improving in-plane uniformity while maintaining relative simplicity of the overall device structure.
Solution Approach 2:
The patent divides the masking function into separate components: an anode mask attached to the anode and an intermediate mask positioned separately between the anode and substrate. This segmentation allows independent optimization of each mask's position and dimensions, improving uniformity control while enabling flexible device configuration.
2Manufacturing precision
If multiple adjustable factors are optimized to achieve high in-plane uniformity, then manufacturing precision is improved, but ease of operation deteriorates
Solution Approach 1:
The patent performs preliminary simulation calculations to determine optimal configurations for the anode mask and intermediate mask before actual plating operations. By pre-calculating the electric field distribution and identifying optimal mask dimensions and positions, the system eliminates the need for operators to manually adjust multiple parameters during operation, thereby improving in-plane uniformity while maintaining ease of operation.
Solution Approach 2:
The patent uses simulation models to create a virtual copy of the plating process, allowing optimization of mask configurations in the virtual environment before implementing them in the physical system. This copying approach enables precise determination of optimal parameters without requiring extensive trial-and-error adjustments in the actual plating device.
3Manufacturing precision
If simulation under all conditions is performed to predict in-plane uniformity, then manufacturing precision is improved, but productivity deteriorates
Solution Approach 1:
The patent performs simulation calculations in advance to establish optimal mask configurations and stores these results for future reference. By pre-calculating the electric field distribution and in-plane uniformity for various mask configurations, the system eliminates the need to perform comprehensive simulations during actual production, thereby maintaining high prediction accuracy while significantly improving productivity.
Solution Approach 2:
The patent performs simulations for a representative set of mask configurations and uses the results to determine optimal parameters without exhaustively simulating every possible condition. This partial action approach provides sufficiently accurate predictions for practical purposes while avoiding the excessive processing time that would result from complete condition space exploration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the determination of suitable implement conditions, reducing the number of trials needed to achieve high in-plane uniformity and improving production efficiency by allowing for precise adjustment of parameters, even for operators with limited experience.
Implementation Method 1
the electric field formed between the anode and the substrate has been controlled
Implementation Method 2
an electroplating method which is relatively inexpensive and has a short processing time is widely used
Implementation Method 3
an analysis unit that estimates a model in which the in-plane uniformity value is used as an objective variable and the one or plural variables are used explanatory variables by regression analysis
Data Source
AI summary
A plating support system is provided and includes a simulator that predicts an in-plane uniformity value of a plating film formed on a substrate based on assumed conditions for an electroplating treatment of the substrate; a numerical analysis data storage unit that stores numerical analysis data in which each assumed condition is associated with the in-plane uniformity value for plural assumed conditions; a regression analysis unit that estimates a model that the in-plane uniformity value is an objective variable and variables of assumed conditions are explanatory variables by regression analysis based on the numerical analysis data; and an implement condition search unit that uses the estimated model to search for implement conditions that are recommended values of the assumed conditions related to the in-plane uniformity of the plating film formed in the electroplating treatment of the substrate to be plated.