Electroplating Apparatus Wafer Holder Suction Pad Spring Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electroplating apparatuses face inefficiencies in automating the bottom surface plating method due to complex automation of cathode electrode and wafer setting, and in the top surface method, ensuring consistent contact pressure and vacuum sealing is difficult, leading to unreliable energization and film uniformity.
Innovation Solution
The electroplating apparatus incorporates a wafer holder with a suction pad and a spring contact type cathode electrode with annular fixing and upward slopes, ensuring secure wafer holding and energization by using a sealing means and adjustable protrusions to maintain contact pressure, allowing for automated and reliable plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a spring contact type cathode electrode is disposed above the top surface of the wafer holder to enable contact with the wafer backside, then the cathode electrode can apply pressure to the wafer, but the wafer cannot be brought into contact with the top surface of the wafer holder and the electrode recess cannot be evacuated
Solution Approach 1:
Instead of having the cathode electrode apply pressure from above (which prevents wafer contact with holder), the invention inverts the approach by using a suction pad to pull the wafer down onto the holder surface, while the cathode electrode contacts the wafer backside. This reversal of the holding mechanism resolves the contradiction between applying contact pressure and enabling evacuation.
Solution Approach 2:
The invention separates the wafer holding function from the cathode electrode contact function. The suction pad and wafer holder handle the holding and evacuation, while the cathode electrode independently provides electrical contact. This segmentation allows both functions to operate effectively without interfering with each other.
2Productivity
If automation is implemented in the bottom surface plating method, then operating efficiency can be improved, but the automation process becomes very complicated
Solution Approach 1:
The wafer holder is designed to perform multiple functions: it holds the wafer via suction pad, provides the electrode recess for evacuation, and supports the cathode electrode contact mechanism. This multi-functionality reduces the need for separate components, simplifying the overall automation apparatus while maintaining high operating efficiency.
3Force
If the cathode electrode tip end is disposed above the top surface of the wafer holder to ensure contact pressure, then energization can be achieved, but the wafer holder cannot assuredly hold the wafer
Solution Approach 1:
The suction pad acts as an intermediary between the wafer holder and the wafer backside. It provides the holding force through vacuum suction, allowing the cathode electrode to focus on providing electrical contact pressure without compromising wafer holding. This intermediary mechanism resolves the contradiction between ensuring contact pressure and ease of wafer holding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures assured wafer holding and energization, improving operational efficiency and film uniformity by maintaining consistent contact pressure and sealing, facilitating automation and practical use.
Implementation Method 1
a suction pad that is fixed to the pad housing recess and suctions the backside of the wafer placed on the wafer holder
Implementation Method 2
a spring contact type cathode electrode that is fixed to the electrode housing recess and presses against a backside of a wafer placed on the wafer holder
Implementation Method 3
whereby the suction pad suctions and holds the backside of the wafer, and the sealing means seals the periphery
Implementation Method 4
a conductive base film is disposed on a front side on which a plating film is being formed and, with the base film as a cathode, a current is flowed in a plating solution to precipitate a plating film on the base film
Data Source
AI summary
An electroplating apparatus includes: a wafer holder that is detachable from an engaging hole of a cathode holder and capable of moving in a up and down direction; a spring contact type cathode electrode that is fixed to an electrode housing recess on a top surface of the wafer holder and presses against a backside of a wafer placed on the wafer holder; and a suction pad that is fixed to a pad housing recess on a top surface of the wafer holder and suctions the backside of the wafer placed on the wafer holder.