Double-Surface Electrostatic Attractor for Wafer Transfer Tray Fixation
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Solution Overview
Problem
The existing plasma treatment apparatuses for semiconductor wafers face challenges in achieving uniform and efficient contact between the wafer transfer tray and the supporter, leading to reduced cooling efficiency and increased complexity in fixing the tray, due to the use of mechanical clamps which can decrease adhesion near the central portion.
Innovation Solution
A plasma treatment apparatus with a wafer transfer tray that employs a double-surface electrostatic attractor, using conductive layers and a ground potential to electrostatically attract both the wafer and the supporter to the tray, reducing mechanical movable parts and enhancing uniform cooling through a cooling gas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a mechanical clamp is used to attach the wafer transfer tray and supporter, then the tray and supporter can be mechanically fixed, but the adhesion between the tray and supporter decreases in the vicinity of the central portion
Solution Approach 1:
The patent replaces the mechanical clamp system with an electrostatic attraction system. The electrostatic attractor generates electrostatic forces that hold the wafer transfer tray against the supporter without mechanical contact, thereby preserving adhesion across the entire surface including the central portion while still achieving secure fixation.
Solution Approach 2:
The patent extracts the mechanical clamp component from the system and replaces it with an electrostatic field-based fixation mechanism. This removal of mechanical elements eliminates the interference with adhesion while maintaining the essential function of securing the tray to the supporter.
2Loss of energy
If the wafer transfer tray and supporter are made to closely contact to minimize cooling gas leakage, then cooling efficiency improves, but the operation becomes complicated due to mechanical clamp requirements
Solution Approach 1:
The patent replaces complex mechanical clamp operations with simple electrostatic field activation. By applying voltage to the electrostatic attractor, the tray is automatically held against the supporter with uniform pressure, achieving close contact for minimal gas leakage without complicated mechanical adjustment operations.
3Reliability
If pressing means is used to fix wafers to the wafer transfer tray, then wafer fixation is achieved, but the effective area in the wafer surface is reduced and the process becomes time-consuming
Solution Approach 1:
The patent replaces mechanical pressing means with electrostatic attraction for wafer fixation. The electrostatic field acts instantaneously across the entire wafer surface without physical contact, achieving secure fixation while maintaining 100% effective wafer area and eliminating time-consuming pressing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient and uniform plasma treatment of wafers by ensuring close contact between the tray and the supporter, reducing cooling gas loss and simplifying the fixation process, while maintaining accurate and uniform plasma treatment across the wafer surface.
Implementation Method 1
a double-surface electrostatic attractor configured to electrostatically attract the wafer to the first surface of the wafer transfer tray and electrostatically attract the supporter to the second surface of the wafer transfer tray
Implementation Method 2
the plasma treatment apparatus configured to form a flow path through which a cooling gas flows between the wafer transfer tray and a supporter that supports the wafer transfer tray, and cool the wafer transfer tray using a cooling gas
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A plasma treatment apparatus includes a wafer transfer tray having a first surface and a second surface opposite to the first surface and configured to hold a wafer on the first surface, a cooling unit configured to cool the wafer transfer tray, a conductive supporter configured to support the second surface of the wafer transfer tray, and a double-surface electrostatic attractor configured to electrostatically attract the wafer to the first surface of the wafer transfer tray and electrostatically attract the supporter to the second surface of the wafer transfer tray.