Electrostatic Carrier Chip Handling Without Temporary Bonding
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Solution Overview
Problem
The chip-on-wafer manufacturing process is costly and time-consuming due to the need for surface activation and hydrophilization treatments of chips before temporary bonding on a carrier wafer, and subsequent debonding processes.
Innovation Solution
A processing system employing an electrostatic carrier with attraction electrodes to hold and transfer chips, eliminating the need for surface activation and hydrophilization treatments by using Coulomb forces for chip handling and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface activation and hydrophilization treatments are performed on chips before bonding, then bonding reliability is improved, but manufacturing cost and time increase
Solution Approach 1:
The invention extracts and removes the unnecessary surface activation and hydrophilization treatment steps from the chip bonding process. By using an electrostatic carrier that holds chips through electrostatic attraction, the patent eliminates these complex chemical treatments while maintaining reliable bonding, thus reducing manufacturing cost and time.
Solution Approach 2:
The invention replaces the chemical-based surface activation and hydrophilization processes with a physical electrostatic holding mechanism. The electrostatic carrier uses electrostatic attraction to secure chips without requiring chemical surface treatments, substituting complex chemical procedures with a simpler physical field-based approach.
2Ease of operation
If multiple chips are temporarily bonded on a carrier wafer, then chip handling is facilitated, but subsequent debonding processes become necessary and time-consuming
Solution Approach 1:
The invention applies dynamics by making the chip holding state controllable and reversible through electrostatic forces. The electrostatic carrier can dynamically adjust its holding of chips by controlling the electrostatic attraction, allowing easy placement and removal of chips without permanent bonding or complex debonding processes.
Solution Approach 2:
The invention changes the parameter of chip adhesion from permanent chemical bonding to controllable electrostatic attraction. By adjusting the electrostatic field parameters, the carrier can easily release chips when needed, eliminating time-consuming debonding processes while maintaining ease of chip handling during assembly.
3Ease of manufacture
If conventional bonding methods are used, then chip mounting is achieved, but process complexity and cost increase
Solution Approach 1:
The electrostatic carrier serves multiple functions: it holds chips during assembly, enables easy transfer between workstations, and allows reversible mounting without permanent bonding. This multi-functional device simplifies the overall manufacturing process by replacing multiple specialized tools and processes with a single versatile electrostatic system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces the cost and time required for chip-on-wafer manufacturing by simplifying chip handling and bonding processes, allowing for repeated use of the electrostatic carrier and independent control of chip attraction states.
Implementation Method 1
by applying a high voltage to the electrode and supplying the reinforcing member with electric charges whose polarity is opposite to that of the voltage applied to the electrode, an attracting force is exerted in the electrostatic holder to attract a target object to be reinforced
Data Source
AI summary
A processing system configured to process multiple chips includes a chip placing apparatus configured to pick the chip up and dispose on an attraction surface of a first electrostatic carrier. The chip placing apparatus includes a placement carrier holder configured to hold the first electrostatic carrier; and a power supply configured to apply a voltage to the first electrostatic carrier held by the placement carrier holder.