Electrostatic Carrier With Insulating Layer for Chip Transfer
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Solution Overview
Problem
Existing chip-on-wafer manufacturing processes damage dicing tapes due to the series of treatments required, and the electrostatic attraction force in existing electrostatic carriers can be compromised by conductive liquids, leading to ineffective chip transfer.
Innovation Solution
An electrostatic carrier with a conductive main body and flexible insulating layer, featuring through holes, is used to attract and hold chips without a solid electrode, ensuring effective electrostatic transfer and minimizing tape damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a solid electrode is used in the electrostatic carrier, then the electrostatic attraction force is strong, but the attraction force is compromised when conductive liquids are applied
Solution Approach 1:
An insulating layer is introduced as an intermediary between the electrode and the external environment. This insulating layer prevents conductive liquids from directly contacting the electrode, thereby maintaining electrostatic attraction stability while still allowing the electrode to generate strong attraction forces. The insulating layer acts as a mediator that isolates the electrode from harmful external factors.
2Manufacturing precision
If surface activation treatment and hydrophilization treatment are performed on chips, then bonding quality is improved, but dicing tape is damaged
Solution Approach 1:
The electrostatic carrier with insulating layer serves as an intermediary platform for performing surface activation and hydrophilization treatments. By placing chips on this carrier instead of directly on dicing tape, the treatments can be applied without damaging the tape, as the carrier protects the tape from direct exposure to treatment chemicals and processes.
3Ease of operation
If dicing tape is used to hold chips, then chip transfer is enabled, but tape integrity is compromised during treatment processes
Solution Approach 1:
The electrostatic carrier acts as an intermediary that assumes the function of holding chips during treatment processes. This replaces the dicing tape's holding function temporarily, allowing the tape to be protected from damage while the carrier performs the chip-holding and transfer operations that would otherwise require the tape to be directly involved in treatments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrostatic carrier effectively transfers diced chips to a wafer while preserving the dicing tape's integrity and maintaining electrostatic attraction, enhancing the chip-on-wafer manufacturing process efficiency.
Implementation Method 1
an electrostatic carrier with a conductive main body and flexible insulating layer, featuring through holes, is used to attract and hold chips
Data Source
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AI summary
A processing method of processing multiple chips using an electrostatic carrier, which includes a main body having conductivity and provided with multiple through holes in a thickness direction thereof; and an insulating layer formed on a front surface of the main body, includes arranging and placing the multiple chips on a holding surface of the electrostatic carrier; supplying power to the main body to electrically charge the main body; and bringing an earth wire into contact with the chip to generate an electrostatic force between the chip and the main body.