Electrostatic Carrier Tray for Semiconductor Wafer Transport

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Solution Overview

Problem

Current methods lack an effective and easy way to transport electronic substrates across various locations without size or form factor restrictions, requiring extensive inventory of specialized trays.

Innovation Solution

An electrostatic carrier tray system comprising a primary substrate, electrostatic field generating circuits, conformal coating, and a power-delivery and control system, allowing secure transport of semiconductive wafers/coupons of varying sizes by generating and maintaining an electrostatic bond, even under force or inversion, with a compact power system for efficient energy supply.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional trays are used to transport electronic substrates, then each substrate size and form factor requires a specific tray type, but manufacturers must maintain extensive inventory of thousands of different tray types

Engineering Contradiction:

Improvetray compatibility with different substrate sizesVSAvoidinventory management complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The electrostatic carrier tray is designed with a universal platform that can accommodate electronic substrates of various sizes and form factors through adjustable electrostatic clamping mechanisms, eliminating the need for multiple specialized tray types while maintaining secure transport for different substrate dimensions

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If conventional mechanical trays are used to secure substrates, then substrates are firmly held in cavities, but the trays become cumbersome and difficult to move between locations

Engineering Contradiction:

Improvesubstrate securementVSAvoidtransport mobility

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent replaces traditional mechanical clamping and cavity-based substrate securing mechanisms with an electrostatic field-based holding system. The electrostatic clamping mechanism generates sufficient holding force to securely retain substrates during transport without requiring complex mechanical structures, thereby improving mobility while maintaining reliability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If electrostatic fields are used to bond substrates to the carrier, then substrates remain securely bonded even under gravitational force or inversion, but electrical interaction between substrates must be prevented

Engineering Contradiction:

Improvesubstrate bonding strengthVSAvoidelectrical interaction between substrates

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces an intermediary insulating layer between the electrostatic carrier tray and the substrates. This insulating layer prevents direct electrical contact and potential harmful electrical interactions between substrates while still allowing the electrostatic field to effectively bond the substrates to the carrier, thus maintaining bonding strength without introducing electrical hazards

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables secure, versatile, and efficient transportation of semiconductive wafers/coupons across different sizes and forms, preventing electrical interaction and physical damage, while allowing easy stacking and handling by robots, ensuring reliable bonding and power delivery.

Implementation Method 1

The plurality of EFG circuits 4 is used to temporarily bond the semiconductive wafers/coupons to the primary substrate 1

Methodology Applied

Scientific EffectElectrostatic field: Electrostatics

Implementation Method 2

The conformal coating 8 protects the plurality of EFG circuits 4 from being damaged by different semiconductive wafers/coupons

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS9246415B2Electrostatic carrier tray

Publication Date: 2016.01.26 DIABLO CAPITAL INC

AI summary

An electrostatic carrier tray is an apparatus that is used to temporarily grasp and to transport semiconductive coupons/wafers. The apparatus mainly includes a primary substrate, a plurality of electrostatics field generating circuits, a conformal coating, a structural backing, and a power-delivery and control system. The electrostatics field generating circuits are positioned on one side of the primary substrate, and the power delivery and control system is positioned on the other side of the primary substrate. The electrostatics field generating circuits are used to bond the semiconductive coupons/wafers to the apparatus. The structural backing is used to handle the apparatus while transporting the semiconductive coupons/wafers and is also used to protect the power-delivery and control system from physical damage. The conformal coating is superimposed onto the electrostatics field generating circuits and the primary substrate as a means of protection.