Electrostatic Chip Carrier Without Internal Wiring for Wet Transfer
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Solution Overview
Problem
Existing chip-on-wafer manufacturing processes damage dicing tapes due to the series of treatments performed on chips, and the electrostatic attraction force in existing electrostatic carriers can be compromised by conductive liquids, leading to inefficient chip transfer.
Innovation Solution
An electrostatic carrier with a conductive main body and flexible insulating layer is used to hold chips, employing through holes and avoiding internal electrode wiring, maintaining electrostatic attraction through a unipolar mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional electrostatic carrier with internal electrode wiring is used, then electrostatic attraction can be generated, but the structure becomes complex and the attraction force can be compromised by conductive liquids
Solution Approach 1:
The patent removes the internal electrode wiring structure from the electrostatic carrier and replaces it with a unipolar electrode design where the carrier body itself serves as the electrode. This extraction of the complex wiring system while maintaining the essential electrostatic attraction function resolves the contradiction between reliability and device complexity.
Solution Approach 2:
The carrier body is designed to serve dual functions: as both the structural carrier and as the electrostatic electrode. This multi-functionality eliminates the need for separate internal wiring, simplifying the structure while maintaining electrostatic attraction capability through the unified design.
2Ease of operation
If dicing tapes are used to hold chips during treatments, then chip handling is enabled, but the tapes are damaged by series of treatments
Solution Approach 1:
The patent employs a disposable electrostatic carrier that replaces the durable but treatment-sensitive dicing tape. While the carrier itself is vulnerable to conductive liquid damage, its disposable nature allows replacement without affecting the expensive wafer or causing environmental damage, thus resolving the contradiction between ease of operation and strength.
Solution Approach 2:
The electrostatic carrier acts as an intermediary between the treatment process and the chip. It provides the necessary chip handling capability during treatments while isolating the sensitive dicing tape from direct exposure to conductive liquids, as the carrier can be easily replaced if damaged.
3Manufacturing precision
If conductive liquids are used in chip treatments, then surface activation and hydrophilization are achieved, but electrostatic attraction force is compromised
Solution Approach 1:
The patent extracts the electrostatic electrode function from the carrier body, making it separable from the treatment process. The unipolar electrode design allows the carrier to be replaced if conductive liquid damage occurs, maintaining manufacturing precision while protecting the electrostatic attraction capability through design rather than physical isolation during treatments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents dicing tape damage and maintains effective electrostatic attraction, enabling efficient chip transfer and bonding to wafers without loss of attraction force.
Implementation Method 1
an electrostatic carrier with a conductive main body and flexible insulating layer is used to hold chips, employing through holes and avoiding internal electrode wiring, maintaining electrostatic attraction through a unipolar mechanism
Data Source
AI summary
A processing method of processing multiple chips using an electrostatic carrier, which includes a main body having conductivity and provided with multiple through holes in a thickness direction thereof; and an insulating layer formed on a front surface of the main body, includes arranging and placing the multiple chips on a holding surface of the electrostatic carrier; supplying power to the main body to electrically charge the main body; and bringing an earth wire into contact with the chip to generate an electrostatic force between the chip and the main body.