Electrostatic Chip Transfer for Adhesive-Free Bonding
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Solution Overview
Problem
The existing technologies face challenges in improving the workability of transferring chips from a carrier to a device substrate, particularly in terms of efficiently separating and mounting chips without adhesive-related issues.
Innovation Solution
A chip attaching device is configured with a first carrier holder, a substrate holder, a pickup device, and a mounting device, utilizing electrostatic attraction and controlled electric charges to separate and mount chips on a device substrate, enhancing the workability of chip transfer and attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive processes are used to attach chips to device substrates, then chip attachment reliability is improved, but manufacturing complexity and processing time increase
Solution Approach 1:
The patent replaces the chemical adhesive bonding system with a mechanical-electrical electrostatic attraction system. The chip carrier includes electrostatic attraction portions that generate electrostatic forces to hold chips during transfer, eliminating the need for adhesive application, curing, and related processing steps while maintaining secure attachment.
Solution Approach 2:
The patent extracts and removes the adhesive bonding function from the chip attachment process. By using electrostatic attraction portions integrated into the chip carrier, the system eliminates the separate adhesive layer and bonding process, simplifying the overall manufacturing workflow while maintaining reliable chip attachment.
2Reliability
If adhesive processes are used to attach chips to device substrates, then chip attachment reliability is improved, but processing time increases
Solution Approach 1:
The patent replaces the multi-step adhesive bonding process (application, positioning, curing) with a single-step electrostatic attraction mechanism. The electrostatic attraction portions activate immediately to secure chips during transfer, eliminating curing time and reducing overall processing time while maintaining attachment reliability.
Solution Approach 2:
The patent implements preliminary action by pre-configuring the chip carrier with electrostatic attraction portions that are ready to engage chips immediately during transfer. This eliminates the need for subsequent bonding steps, as the electrostatic hold is established and maintained throughout the transfer process and can be released on-demand.
3Ease of operation
If electrostatic attraction is used to hold chips on carrier, then chip transfer workability is improved, but control precision of electrostatic field is worsened
Solution Approach 1:
The patent divides the electrostatic field control into multiple independent electrostatic attraction portions on the chip carrier. Each portion can be controlled separately, allowing precise local adjustment of electrostatic forces. This segmentation enables independent control of different chip positions, improving overall control precision while maintaining ease of operation.
Solution Approach 2:
The patent implements feedback control for the electrostatic attraction portions, where the state of chip attachment is monitored and the electrostatic field strength is adjusted accordingly. This feedback mechanism ensures precise control of the electrostatic forces, maintaining optimal holding strength without excessive or insufficient attraction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the workability of chip transfer by allowing for stable electrostatic attraction and controlled separation, reducing the need for adhesive processes and enhancing the efficiency of chip attachment on device substrates.
Implementation Method 1
multiple attraction portions 21a, the attraction portion being configured to electrostatically attract the chip
Data Source
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Figure 2A~2C
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AI summary
A chip attaching device is configured to attach a chip having a second device to a device substrate having multiple first devices on a main surface thereof, and the second device is to be electrically connected to the first device. The chip attaching device includes a first carrier holder, a substrate holder, a pickup device and a mounting device. The first carrier holder is configured to hold a chip carrier which has, on a front surface thereof, multiple attraction portions, the attraction portion being configured to electrostatically attract the chip. The substrate holder is configured to hold the device substrate. The pickup device is configured to separate the chip from the chip carrier held by the first carrier holder. The mounting device is configured to mount the chip separated from the chip carrier by the pickup device on the device substrate held by the substrate holder.