Electrostatic Chuck Module Structure for 450°C Operation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrostatic chuck modules cannot operate at temperatures above the heat resistance temperature of the resin used in the adhesive layer, limiting their operational temperature to below 150°C.
Innovation Solution
The electrostatic chuck module incorporates a base with a coolant flow path, a concave part, and a convex part, along with an insulator, a resistance heating element, a crack plate, and a ceramics plate with an electrode for static electricity adsorption. The module uses an inorganic adhesive and insulating material to bond components, allowing operation at temperatures up to 450°C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If silicone resin adhesive is used to bond the metal base and main substrate, then the assembly is easy to manufacture, but the operating temperature is limited to below 150°C due to heat resistance constraints
Solution Approach 1:
The patent changes the material parameter of the adhesive from organic silicone resin to inorganic adhesive, fundamentally altering the heat resistance characteristic. This material substitution enables the bonding structure to withstand temperatures of 450°C or higher while maintaining the bonding function, thus resolving the contradiction between ease of manufacture and temperature limitation.
2Temperature
If the ceramics plate is heated to high temperatures, then the heating function is improved, but thermal stress causes the ceramics plate to crack or break
Solution Approach 1:
The patent applies thermal expansion principles by selecting materials for the crack plate and ceramics plate with matched thermal expansion coefficients. This ensures that both materials expand and contract at similar rates during temperature changes, minimizing differential thermal stress and preventing cracks or breaks in the ceramics plate during high-temperature operation.
Solution Approach 2:
The patent uses a composite structure consisting of the crack plate and ceramics plate bonded together. By carefully selecting materials with compatible thermal properties and bonding them through inorganic adhesive, the composite structure can withstand high temperatures without cracking, combining the heating capability with structural integrity.
3Temperature
If the base is made larger to accommodate coolant flow paths, then cooling capability is improved, but the overall device size increases
Solution Approach 1:
The patent applies the nesting principle by integrating the coolant flow paths within the base structure itself. The flow paths are formed as internal channels or cavities within the base, allowing the cooling function to be embedded without significantly increasing the external dimensions of the base. This maintains compact device size while achieving effective cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the electrostatic chuck module to operate at temperatures significantly higher than previous limitations, achieving uniform heating control and reducing thermal stress on the ceramics plate, thus preventing breakage and ensuring reliable bonding at high temperatures.
Implementation Method 1
a base (101) that includes a flow path (101d) for a coolant disposed below the base
Implementation Method 2
a resistance heating element (106) disposed on or within the insulator (102)
Implementation Method 3
a ceramics plate (104) disposed on the crack plate (103) and that includes an electrode (107) that adsorbs a target object with static electricity
Data Source
AI summary
An electrostatic chuck module operates at temperatures above the heat resistance temperature of a resin. The electrostatic chuck module includes: a base that includes a flow path for a coolant disposed below the base, a concave part disposed on the base, and a convex part disposed along an outer circumference of the base; an insulator disposed in the concave part of the base; a resistance heating element disposed on or within the insulator; a crack plate disposed on the insulator and the resistance heating element; and a ceramics plate disposed on the crack plate and that includes an electrode that adsorbs a target object with static electricity. The convex part of the base is bonded to the crack plate.