Electrostatic Chuck Adhesion Layers for Temperature Uniformity

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Solution Overview

Problem

Existing electrostatic chuck devices face challenges in achieving in-plane temperature uniformity and durability due to uneven heat input from plasma etching, leading to temperature distribution issues and potential cracking from rapid temperature changes.

Innovation Solution

An electrostatic chuck device with a specific configuration including an electrostatic chuck section, adhesion layers with joining and silicone adhesive layers, and a temperature adjusting base section, where the adhesion layers have a thickness range of 1 nm to 500 nm and 2 μm to 30 μm, respectively, and a sheet material thicker than the total adhesion layer thickness, to enhance adhesiveness and temperature uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a plasma etching technique is used to process the wafer, then production efficiency and fine processing capability are improved, but the surface temperature of the wafer rises causing temperature distribution and in-plane temperature non-uniformity

Engineering Contradiction:

Improveproduction efficiencyVSAvoidsurface temperature

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The temperature adjusting base section is divided into multiple heating sections with independent temperature control, allowing different regions to be heated to different temperatures to compensate for plasma-induced temperature distribution

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the temperature adjusting base section are configured with different heating capabilities to achieve local temperature adjustment, specifically addressing the temperature distribution caused by plasma etching

Inventive Principle:

Principle #3Local quality

2Temperature

If a heater function is added to adjust temperature, then temperature control capability is improved, but cracks are generated in the electrostatic chuck section or base section due to rapid temperature changes

Engineering Contradiction:

Improvetemperature control capabilityVSAvoiddurability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The heating sections are configured to operate dynamically with independent temperature control, allowing gradual and controlled temperature adjustments rather than rapid changes, thereby preventing thermal shock and cracking

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

Temperature adjustment parameters are optimized by controlling the heating sections to operate within safe temperature change rates, preventing thermal stress that would cause cracking

Inventive Principle:

Principle #35Parameter changes

3Temperature

If gas such as helium is used to adjust in-plane temperature distribution, then temperature uniformity is improved, but local temperature control capability is lost

Engineering Contradiction:

Improvein-plane temperature uniformityVSAvoidlocal temperature control capability

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The temperature adjusting base section is segmented into multiple independently controllable heating sections, replacing the uniform gas heating approach and enabling both global temperature uniformity and local temperature control

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The gas heating system is replaced with a solid-state heating section system that provides both uniform temperature distribution and localized temperature control through independent section management

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The configuration ensures excellent adhesiveness and in-plane temperature uniformity, reducing thermal conductivity variations and enhancing the durability of the electrostatic chuck device by maintaining consistent temperature across the wafer surface.

Implementation Method 1

an electrostatic chuck section (102) having one principal surface serving as a placing surface on which a plate-shaped sample is placed, and having a built-in electrostatic attracting internal electrode

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

a temperature adjusting base section which adjusts a temperature of the electrostatic chuck section to a desired temperature

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a plurality of heating members bonded to a surface on the side opposite to the placing surface of the electrostatic chuck section

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS10192766B2Electrostatic chuck device

Publication Date: 2019.01.29 SUMITOMO OSAKA CEMENT CO LTD

AI summary

An electrostatic chuck device 80 includes: an electrostatic chuck section 2 having one principal surface serving as a placing surface on which a plate-shaped sample is placed, and having a built-in electrostatic attracting internal electrode; a first adhesion layer 4; a sheet material 6; a second adhesion layer 8; and a temperature adjusting base section 10 which adjusts a temperature of the electrostatic chuck section 2 to a desired temperature, in this order, in which the first adhesion layer 4 includes a joining layer 14 having a layer thickness in a range of 1 nm to 500 nm, and a silicone adhesive layer 24 having a thickness in a range of 2 μm to 30 μm, and the second adhesion layer 8 includes a joining layer 18 having a layer thickness in a range of 1 nm to 500 nm, and a silicone adhesive layer 28 having a thickness in a range of 2 μm to 30 μm.