Electrostatic Chuck Adhesive Layer Erosion Prevention Coating
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Solution Overview
Problem
Conventional electrostatic chucks face issues with adhesive layer erosion in plasma environments, leading to wafer contamination and particle generation, due to inadequate protection methods such as the use of materials like acrylic rubber and thermosetting resin, which lack plasma resistance and are affected by temperature variations.
Innovation Solution
An electrostatic chuck with an adhesive layer erosion prevention coating layer formed by spraying ceramic powder in a vacuum state, ensuring a constant supply of ceramic powder to a carrier gas at a fixed rate, preventing pores and cracks, and using materials like Y2O3, YF3, Al2O3, AlN, SiC, TiO2, and YAG for the coating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal spraying or cold spraying methods are used to coat ceramic powder on the adhesive layer, then the adhesive layer can be protected from plasma erosion, but the adhesive layer melts down due to high temperature
Solution Approach 1:
The patent applies aerosol deposition method in a vacuum environment to coat ceramic powder on the adhesive layer without thermal damage. The vacuum atmosphere allows ceramic powder to be deposited at room temperature, protecting the adhesive layer from melting while still providing plasma erosion resistance.
Solution Approach 2:
The patent replaces thermal spraying methods with aerosol deposition method, substituting thermal energy with kinetic energy of aerosolized ceramic particles. This mechanical deposition process occurs at room temperature, avoiding adhesive layer damage while achieving protective coating.
2Manufacturing precision
If CVD or PVD methods are used to form coating layer, then thin film can be formed, but the coating layer cracks when thickness exceeds 2 μm and uniform coating on three-dimensional surfaces is difficult
Solution Approach 1:
The patent uses aerosol deposition method where ceramic powder is aerosolized and transported through a transfer tube using gas flow. This pneumatic delivery system enables uniform coating on three-dimensional surfaces by controlling the aerosol flow and deposition rate, preventing cracks while achieving desired thickness.
Solution Approach 2:
The patent changes the deposition parameters by controlling aerosol concentration, gas flow rate, and deposition time to achieve uniform coating thickness on complex geometries. This parameter control prevents cracking by maintaining optimal deposition rates regardless of surface curvature.
3Temperature
If aerosol deposition method is used with compressed gas to aerosolize ceramic powder, then coating can be performed at room temperature, but constant amount of powder cannot be supplied due to irregular scattering
Solution Approach 1:
The patent implements a feedback control system that monitors the aerosolized powder flow rate and adjusts the gas flow or powder feed rate to maintain constant deposition amount. This feedback mechanism compensates for irregular scattering and ensures uniform coating thickness.
Solution Approach 2:
The patent replaces simple compressed gas aerosolization with a more controlled aerosol generation system that regulates powder delivery. This substitution maintains room temperature operation while achieving consistent powder supply through improved aerosolization control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents adhesive layer erosion and particle generation, extends the lifespan of the electrostatic chuck, and improves processing yield in semiconductor manufacturing by ensuring a uniform and robust coating layer.
Implementation Method 1
a method of spraying and coating ceramic powder which has been aerosolized in a vacuum state
Implementation Method 2
spraying and coating ceramic powder which has been aerosolized in a vacuum state under a condition of 0 to 50° C.
Implementation Method 3
an adsorption unit for adsorbing a wafer using electrostatic force
Data Source
AI summary
Provided is an electrostatic chuck including: a base material; an adsorption unit for adsorbing a wafer by using electrostatic force; an adhesive layer for adhering the adsorption unit to the base material; and an adhesive layer anti-corrosion coating layer provided to cover an exposed surface of the adhesive layer, wherein the adhesive layer anti-corrosion coating layer has no pores or cracks since the adhesive layer anti-corrosion coating layer is made by a method of spraying and coating, at conditions of 0-50° C. and a vacuum state, ceramic powder which is continuously supplied at a constant quantity to the carrier gas of which a fixed flow rate is controlled, and a method for manufacturing an electrostatic chuck, including the steps of: (a) forming an adhesive layer for adhering an adsorption unit for adsorbing a wafer to a base material by using electrostatic force; and (b) forming an adhesive layer anti-corrosion coating layer which covers an exposed surface of the adhesive layer and has no pores or cracks as it is made by a method of spraying and coating, at conditions of 0-50° C. and a vacuum state, ceramic powder which is continuously supplied at a constant quantity to the carrier gas of which a fixed flow rate is controlled.