Electrostatic Chuck Adhesive-Free Bonding
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Solution Overview
Problem
The existing electrostatic chucks used in plasma processing apparatuses face issues with substrate holding and temperature adjustment, as adhesives can lose flexibility and cause damage due to temperature differences between the base and the chuck main body, leading to peeling, cracking, and warpage.
Innovation Solution
An electrostatic chuck design that includes a base, a dielectric layer, and a chuck main body with electrodes to generate electrostatic attractive forces, allowing for adhesive-free fixation and temperature control, using a dielectric layer to manage thermal expansion and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesives are used to bond the chuck main body to the base, then the structural integrity is improved, but the adhesives lose flexibility and cause damage due to temperature differences, leading to peeling, cracking, and warpage
Solution Approach 1:
The invention removes the adhesive layer from the structure, eliminating the source of reliability problems. The chuck main body is directly bonded to the base without any intermediate adhesive material, thus preventing peeling, cracking, and warpage caused by adhesive degradation under temperature differences.
Solution Approach 2:
The invention employs a composite structure where the chuck main body and base are directly bonded through compatible material interfaces. This direct bonding approach ensures thermal expansion compatibility and structural integrity without the intermediate adhesive layer that fails under thermal stress.
2Force
If a DC power supply is electrically connected to the electrode of the chuck main body, then electrostatic attractive force is generated to hold the substrate, but the existing structure lacks proper electrode configuration for effective substrate holding
Solution Approach 1:
The electrode in the chuck main body is configured with specific local properties to generate effective electrostatic attractive force. The electrode is positioned and shaped to create concentrated electric fields in the substrate mounting region, ensuring strong and uniform substrate holding capability.
3Ease of manufacture
If the chuck main body is bonded onto the base with an adhesive, then the assembly is simplified, but temperature adjustment causes adhesive degradation and structural damage
Solution Approach 1:
The adhesive layer is completely removed from the structure, eliminating the component that degrades under thermal stress. The direct bonding between the chuck main body and base avoids all problems associated with adhesive degradation, including peeling, cracking, and warpage.
Solution Approach 2:
The bonding interface is designed to accommodate temperature variations through appropriate material selection and structural configuration. The direct bond allows for thermal expansion and contraction without the constraints imposed by adhesive layers, preventing thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses peeling, cracking, and warpage of the electrostatic chuck by using electrostatic forces to fix the chuck main body to the base without adhesives, ensuring reliable substrate holding and temperature management.
Implementation Method 1
The first electrode is provided in the substrate mounting region in order to generate an electrostatic attractive force between a substrate mounted on the substrate mounting region and the chuck main body
Implementation Method 2
The second electrode and the third electrode are provided in the ceramic main body and are provided between the first electrode and the dielectric layer in order to generate an electrostatic attractive force between the chuck main body and the dielectric layer
Implementation Method 3
A flow channel for a heat exchange medium (for example, a refrigerant) is formed in the base. By supplying the heat exchange medium to the base, heat exchange is performed between the base and the chuck main body, the temperature of the chuck main body is adjusted
Data Source
AI summary
An electrostatic chuck of an embodiment includes a base, a dielectric layer, and a chuck main body. The dielectric layer is provided on the base, and is fixed to the base. The chuck main body is mounted on the dielectric layer. The chuck main body has a ceramic main body, a first electrode, a second electrode, and a third electrode. The ceramic main body has a substrate mounting region. The first electrode is provided in the substrate mounting region. The second electrode and the third electrode form a bipolar electrode. The second electrode and the third electrode are provided in the ceramic main body, and are provided between the first electrode and the dielectric layer.