Electrostatic Chuck Adhesive Path Design
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Solution Overview
Problem
The existing electrostatic chuck devices with a stepped shape on the attraction plate are insufficient in prolonging the life of the device due to inadequate extension of the adhesive path, leading to premature degradation during semiconductor manufacturing processes.
Innovation Solution
An electrostatic chuck device design featuring a ceramic plate with a dike portion surrounding the electrode, a temperature controlling base member with a groove to accommodate the dike portion, and an adhesive layer filled with a resin material, including a second resin material with higher plasma resistance, to prolong the device's life by delaying the exposure of the electrode to plasma etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If a stepped shape is provided in the attraction plate to lengthen the adhesive path, then the device life is extended, but the effect is insufficient and the device life cannot be sufficiently prolonged
Solution Approach 1:
The adhesive layer is segmented into multiple regions with different functions: a first adhesive region providing structural bonding and a second adhesive region with higher plasma resistance providing protective coverage. This segmentation allows each region to optimize its performance for its specific function, resolving the contradiction between extending adhesive path and ensuring adequate protection.
Solution Approach 2:
The invention uses composite adhesive materials with different plasma resistance properties in different regions. The second adhesive region employs a material specifically selected for higher plasma resistance, creating a composite structure that combines structural integrity with enhanced plasma protection, thereby sufficiently prolonging device life.
2Duration of action of moving object
If the adhesive path is extended using a stepped shape, then plasma etching time is delayed, but the protection effectiveness is insufficient
Solution Approach 1:
Different regions of the adhesive layer are assigned different material qualities based on their functional requirements. The second adhesive region surrounding the electrode uses material with higher plasma resistance, while the first adhesive region uses material optimized for bonding strength. This local differentiation provides targeted protection where plasma exposure is most critical.
Solution Approach 2:
The second adhesive region acts as an intermediary protective layer between the plasma environment and the electrode. This intermediate layer with higher plasma resistance serves as a buffer that delays plasma etching progression toward the electrode, effectively protecting the critical electrode structure.
3Ease of manufacture
If a simple adhesive structure is used, then manufacturing is easier, but the adhesive is quickly etched by plasma
Solution Approach 1:
The adhesive application process is segmented into distinct steps for applying the first and second adhesive regions, allowing each region to be optimized independently. This segmentation enables the use of higher plasma resistance material in the critical second region without complicating the overall manufacturing process excessively.
Solution Approach 2:
The invention changes the material parameter (plasma resistance) of the adhesive in the second region while maintaining compatibility with the first adhesive region. This parameter change enhances durability without fundamentally altering the manufacturing approach, as both regions use adhesive materials that can be applied using similar techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prolongs the life of the electrostatic chuck device by lengthening the adhesive path and enhancing plasma resistance, reducing the risk of electric discharge and mechanical failure during semiconductor processing.
Implementation Method 1
an electrode for electrostatic attraction which is provided on a surface side of the ceramic plate which is opposite to the mounting surface side
Implementation Method 2
the temperature controlling base member is configured to cool the electrostatic chuck member
Data Source
AI summary
An electrostatic chuck device includes an electrostatic chuck member and a temperature controlling base member. The electrostatic chuck member has a ceramic plate having a mounting surface on which a plate-shaped sample is mounted, and an electrode for electrostatic attraction provided on the other surface on the side opposite the mounting surface of the ceramic plate. The temperature controlling base member is disposed on the surface on the side opposite the ceramic plate side of the electrode for electrostatic attraction and cools the electrostatic chuck member. The ceramic plate has a dike portion which extends to the temperature controlling base member side and surrounds the electrode for electrostatic attraction, the temperature controlling base member has a groove portion accommodating an end part of the dike portion, and a space between the groove portion and the dike portion is filled with a filling part formed of a resin material.