Electrostatic Chuck Adhesive Repair Without Thermal Separation
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Solution Overview
Problem
Existing methods for repairing eroded adhesive layers in electrostatic chuck devices, such as winding a thread-like adhesive and heat-pressing, lead to thermal expansion differences and separation issues, while also being complex and difficult to execute.
Innovation Solution
A method using a cold-curing adhesive to repair eroded adhesive layers between the electrostatic chuck member and the temperature-controlling base member, with a curing temperature between -25°C and 75°C, viscosity less than 100 Pa·s, and elastic modulus of 100 MPa or less, to prevent internal stress and ensure easy repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If a thread-like adhesive is wound around the side surface of the eroded adhesive layer and heat-pressed, then the adhesive layer can be repaired, but thermal expansion difference causes the electrostatic chuck member to separate
Solution Approach 1:
The patent changes the curing temperature parameter from high temperature (heat-pressing) to low temperature (cold-curing, -25°C to 75°C), which eliminates thermal expansion differences between the metal base member and ceramic chuck member, preventing separation while maintaining bonding strength
Solution Approach 2:
The patent replaces the mechanical heat-pressing system with a chemical cold-curing adhesive system, eliminating the need for thermal energy and associated thermal expansion issues while achieving effective bonding through chemical reaction
2Ease of repair
If a thread-like adhesive is wound and heat-pressed, then the adhesive layer can be repaired, but the repair process becomes complex and difficult to execute
Solution Approach 1:
The patent extracts and eliminates the complex heat-pressing equipment and multi-step winding process, replacing them with a simple cold-curing adhesive application that requires no special equipment or complex operations
Solution Approach 2:
The patent uses a simple disposable cold-curing adhesive that can be applied directly without requiring expensive, complex heat-pressing machinery, making the repair process accessible and easy to perform
3Duration of action of stationary object
If the adhesive layer is eroded by plasma, then the electrostatic chuck device can be used, but thermal conductivity becomes non-uniform causing wafer temperature non-uniformity and warping
Solution Approach 1:
The patent performs preliminary repair of the adhesive layer using cold-curing adhesive before the erosion causes critical failure, restoring uniform thermal conductivity and preventing wafer temperature non-uniformity and warping
Solution Approach 2:
The patent restores the thermal conductivity parameter of the adhesive layer by replacing eroded adhesive with fresh cold-curing adhesive, ensuring uniform heat dissipation across the electrostatic chuck member and maintaining wafer temperature uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for easy and effective repair of eroded adhesive layers, preventing internal stress and ensuring uniform heat dissipation and voltage resistance in the electrostatic chuck device.
Implementation Method 1
a method using a cold-curing adhesive to repair eroded adhesive layers between the electrostatic chuck member and the temperature-controlling base member, with a curing temperature between -25°C and 75°C
Implementation Method 2
perform uniform heat conduction between the electrostatic chuck member and the temperature-controlling base member
Data Source
AI summary
A method for repairing an electrostatic chuck device that is formed by bonding an electrostatic chuck member made of ceramics and a temperature-controlling base member made of metal with a first adhesive layer sandwiched therebetween is provided. The method includes a step of repairing the first adhesive layer that has been eroded by using a cold-curing adhesive.