Electrostatic Chuck Adhesive Sheet With Heat-Resistant Low-Modulus Resin
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Solution Overview
Problem
Conventional adhesive sheets for electrostatic chucks face challenges in maintaining heat resistance and adhesion at high temperatures while accommodating thermal expansion differences between ceramic and metal components, often resulting in peeling or deformation.
Innovation Solution
A resin composition combining polyimides or polyamic acids with specific diamine and acid anhydride residues, along with a thermosetting resin, to create a sheet with low elastic modulus and improved thermal expansion matching, enhancing adhesion and heat resistance up to 200°C or higher.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat-resistant resin such as polyimide is used, then heat resistance is improved, but the elastic modulus becomes high causing deformation or cracking due to inability to absorb thermal expansion difference
Solution Approach 1:
The patent uses a composite material consisting of polyimide base resin and silicone resin elastic phase. The polyimide provides heat resistance while the silicone elastic phase provides low elastic modulus and thermal expansion absorption capability. This composite structure resolves the contradiction by combining materials with complementary properties.
Solution Approach 2:
The silicone elastic phase is distributed within the polyimide adhesive layer to create local regions with different mechanical properties. These local elastic phases provide thermal expansion absorption and stress relief while the overall structure maintains heat resistance from the polyimide matrix.
2Temperature
If a silicone resin elastic phase is laminated on polyimide adhesive layer, then thermal expansion is reduced and heat resistance is improved, but peeling occurs between layers due to difference in elastic modulus
Solution Approach 1:
Instead of laminating silicone elastic phase on polyimide adhesive layer (separate layers), the patent merges them into a single integrated adhesive composition where silicone resin elastic phase is dispersed within the polyimide matrix. This eliminates the interface between layers and prevents peeling while maintaining both heat resistance and elasticity.
3Reliability
If conventional thermoplastic resin is used, then adhesion is achieved, but operating temperature is limited to 100°C or lower due to heat resistance of resin
Solution Approach 1:
The patent creates a composite adhesive material combining polyimide (providing heat resistance for high-temperature operation) with silicone resin elastic phase (providing adhesion and flexibility). This composite enables the adhesive to function at temperatures up to 200°C or higher while maintaining adhesion properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition achieves excellent heat resistance and adhesion, maintaining a stable adhesion state over a wide temperature range by reducing thermal expansion differences, thus preventing peeling and deformation.
Implementation Method 1
the difference in thermal expansion between the ceramic and the cooling plate cannot be absorbed, and deformation or cracking occurs
Implementation Method 2
a silicone resin elastic phase capable of reducing thermal expansion
Data Source
AI summary
The purpose of the present invention is to provide a resin composition which enables manufacturing an adhesive sheet for a electrostatic chuck which has excellent heat resistance, low elastic modulus, mitigates the substrate thermal expansion difference with a single layer, and is capable of adhesion and following. The resin composition contains a polymer (A) selected from polyimide and polyamic acid that have a diamine residue of a specific structure (below, the diamine residue (1)) and an acid anhydride residue of a specific structure (below, the acid anhydride residue (2)), and a thermosetting resin (B).