Electrostatic Chuck Acrylic Adhesive Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electrostatic chuck devices face issues with stress relief and insulation property reduction due to the use of silicone-based adhesives reacting with etching gases and acrylic adhesives having high Shore hardness and significant curing shrinkage, leading to void generation.
Innovation Solution
An electrostatic chuck device is designed with an acrylic adhesive layer having flexibility and insulation properties, bonded between the electrostatic chuck section and the cooling plate section, containing vinyl acetate or vinyl butyrate, to relieve stress and prevent voids, ensuring improved insulation and corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silicone-based adhesive is used to bond the electrostatic chuck section and cooling plate section, then bonding strength is achieved, but the adhesive reacts with etching gases causing corrosion
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by specifying an acrylic-based adhesive with particular functional groups (carboxyl, hydroxyl, or amino groups) instead of silicone-based adhesive. This parameter change provides both adequate bonding strength and resistance to etching gases, resolving the contradiction between bonding strength and corrosion resistance.
2Strength
If acrylic adhesive with high Shore hardness (D70 or more) is used, then bonding strength is improved, but stress relief capability is reduced
Solution Approach 1:
The patent optimizes the Shore hardness parameter of the acrylic adhesive to be within D0 to D60, balancing bonding strength and stress relief capability. This parameter range provides sufficient adhesion while maintaining flexibility to accommodate thermal expansion differences and relieve stress between the electrostatic chuck section and cooling plate section.
3Strength
If acrylic adhesive with high curing shrinkage is used, then bonding strength is improved, but voids are generated reducing insulation properties
Solution Approach 1:
The patent controls the curing shrinkage parameter of the acrylic adhesive by specifying functional group content (carboxyl: 0.1-10 mmol/g, hydroxyl: 0.1-10 mmol/g, or amino: 0.1-5 mmol/g) and crosslinking agent content (1-50 wt%). This optimization reduces excessive shrinkage that causes void formation while maintaining adequate bonding strength, thereby preserving insulation properties.
Solution Approach 2:
The patent creates a composite adhesive system by combining acrylic resin with specific crosslinking agents and functional group-containing compounds. This composite formulation achieves a balance between bonding strength and low shrinkage, preventing void formation and maintaining insulation reliability.
4Strength
If rigid adhesive is used to maintain structural integrity, then mechanical strength is improved, but flexibility for stress relief is reduced
Solution Approach 1:
The patent optimizes the rigidity parameter of the adhesive by controlling Shore hardness (D0-D60) and formulating with acrylic resin combined with crosslinking agents. This creates an adhesive with intermediate rigidity that provides mechanical strength for structural integrity while maintaining sufficient flexibility to relieve thermal stress and accommodate expansion differences.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively relieves stress and thermal expansion differences, maintains insulation properties, and enhances corrosion resistance, preventing dielectric breakdown and void formation, thus improving the electrostatic chuck device's performance.
Implementation Method 1
the electrostatic chuck section and the heating member are bonded to and integrated with the cooling plate section through an acrylic adhesive layer having flexibility and insulation properties... stress between the electrostatic chuck section and the cooling plate section can be relieved
Implementation Method 2
an electrostatic chuck section that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in
Implementation Method 3
the wafer is cooled from the underside by circulating a cooling medium such as water to a cooling plate section of the electrostatic chuck device
Implementation Method 4
a heater member is mounted between an electrostatic chuck section and a cooling plate section... a heating member is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section
Data Source
AI summary
An electrostatic chuck device (1) according to the invention includes an electrostatic chuck section (2) that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling plate section (3) that cools the electrostatic chuck section (2), wherein a heating member (5) is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section (2) through a first adhesive material layer (4), and the electrostatic chuck section (2) and the heating member (5) are bonded to and integrated with the cooling plate section (3) through an acrylic adhesive layer (9) having flexibility and insulation properties.