Electrostatic Chuck Adhesive Repair Using String-Like Material
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Solution Overview
Problem
The existing electrostatic chuck devices face issues with non-uniform thermal conductivity and adhesive layer erosion during plasma etching, leading to temperature deviations and wafer bending, necessitating frequent replacement of ceramic plates despite their durability.
Innovation Solution
A method and apparatus for uniformly repairing eroded adhesive layers in electrostatic chuck devices using a string-like adhesive made of the same material as the original adhesive, applied with thermal compression, ensuring uniform thermal conductivity and extending the life of the ceramic plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If liquid adhesive dissolved in solvent is applied to repair eroded adhesive layer, then the adhesive layer can be repaired, but voids are generated due to solvent evaporation causing non-uniform thermal conductivity
Solution Approach 1:
The invention changes the physical state of the adhesive from liquid (dissolved in solvent) to solid (adhesive string), eliminating the solvent evaporation issue that causes voids and non-uniform thermal conductivity. The adhesive string is applied in solid form and then thermally compressed to achieve uniform repair without voids.
Solution Approach 2:
The invention replaces the chemical process (solvent evaporation) with a mechanical process (thermal compression). Instead of relying on solvent evaporation to set the adhesive, the adhesive string is thermally compressed to achieve bonding, which eliminates void formation and ensures uniform thermal conductivity.
2Ease of repair
If adhesive layer is repaired using conventional liquid adhesive method, then repair can be performed, but ceramic plate replacement is still necessary due to non-uniform thermal conductivity
Solution Approach 1:
The invention changes the adhesive application method from liquid to solid string form, which fundamentally prevents void formation and ensures uniform thermal conductivity. This allows the ceramic plate to maintain its performance and be reused, improving device reliability.
Solution Approach 2:
The invention enables recovery and reuse of the ceramic plate by providing a repair method that maintains uniform thermal conductivity. Instead of discarding the ceramic plate when the adhesive layer erodes, the uniform repair allows the ceramic plate to continue being used, reducing waste and improving reliability.
3Object-affected harmful factors
If erosion preventing insulating material is provided at side surface of adhesive layer, then erosion can be suppressed, but the solution is insufficient to fully prevent plasma erosion
Solution Approach 1:
The invention applies adhesive string to the side surface of the adhesive layer before plasma erosion occurs, creating a protective barrier in advance. This preliminary action prevents erosion from compromising the thermal conductivity uniformity, ensuring reliable operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively repairs eroded adhesive layers, maintaining uniform thermal conductivity and preventing wafer defects, thus reducing maintenance costs and extending the lifespan of electrostatic chuck devices.
Implementation Method 1
a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter
Implementation Method 2
the wafer is processed by, e.g., plasma etching in a state where temperature of the wafer is controlled to be maintained at a desired level by heating an attracting surface (chuck surface) by a heater built in the chuck
Implementation Method 3
The electrostatic chuck device attracts an object to be attracted such as a wafer or the like by static electricity generated by applying a voltage to an internal electrode embedded in an insulating member
Implementation Method 4
an exposed side surface of an adhesive layer between the metal base and the ceramic plate is eroded by the side etching of the plasma during the processing of the wafer
Data Source
AI summary
In a repairing method for an electrostatic chuck device in which at least an adhesive layer and an attracting layer are provided on a metal base, a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter. A repairing apparatus for an electrostatic chuck device, which is used in the repairing method, includes a rotatable table for rotating the electrostatic chuck device and a bobbin for supplying the adhesive to the adhesive layer.