Electrostatic Chuck Aluminum Brazing and Epoxy Filling
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Solution Overview
Problem
Existing methods for manufacturing semiconductor support structures with multiple chucking electrodes are costly and time-intensive.
Innovation Solution
A method involving the use of metallic aluminum as a joining layer between ceramic plates, which are brazed together at a temperature of 770 C to 1200 C in a non-oxygenated atmosphere, followed by machining of an exclusion pattern and filling with a high dielectric epoxy to create an electrostatic chuck with multiple chucking electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional methods are used to manufacture semiconductor support structures with multiple chucking electrodes, then manufacturing precision and reliability are maintained, but manufacturing cost and time increase significantly
Solution Approach 1:
The electrostatic chuck is divided into multiple ceramic plates (first ceramic plate, second ceramic plate) with separate electrodes (first electrode, second electrode) that can be independently manufactured and then assembled. This segmentation allows each component to be optimized separately while reducing overall manufacturing complexity and cost.
Solution Approach 2:
A conductive adhesive layer is introduced as an intermediary between the first electrode and the second ceramic plate, and between the second electrode and the first ceramic plate. This adhesive layer facilitates electrical connection and mechanical bonding while enabling flexible assembly processes that reduce manufacturing difficulty and cost.
2Productivity
If ceramic plates are joined using traditional bonding methods, then structural integrity is maintained, but manufacturing time and complexity increase
Solution Approach 1:
The bonding process utilizes controlled heating to specific temperature ranges and application of pressure to activate the conductive adhesive. By controlling thermal and mechanical parameters, the adhesive achieves optimal bonding strength and hermetic sealing properties, enabling faster manufacturing without compromising joint quality.
Solution Approach 2:
The assembly combines dissimilar materials (ceramic plates, conductive adhesive, metal electrodes) into a composite structure. Each material contributes its superior properties: ceramics provide thermal and electrical insulation, the conductive adhesive provides electrical connectivity and bonding, creating a unified structure with enhanced overall performance manufactured through simplified processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces costs and time while achieving a hermetically sealed, high-performance electrostatic chuck capable of withstanding 10,000V without cross-talk, preserving the material properties of the ceramic and providing a durable, efficient semiconductor support structure.
Implementation Method 1
The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated.
Implementation Method 2
The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.
Data Source
AI summary
A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.