Electrostatic Chuck Annular Grooves for Substrate Temperature Uniformity

The patent introduces an intermediary structure (protrusions and grooves) between the seal bands and the substrate. The grooves are positioned between adjacent seal bands and extend from the substrate contact surface toward the heat transfer space, creating a mediating structure that prevents direct contact while allowing controlled heat transfer. This intermediary approach resolves the contradiction by eliminating local temperature singularities while preserving temperature control capability.

The patent segments the heat transfer space into multiple regions using seal bands with integrated grooves. Each groove creates a distinct heat transfer path, allowing independent temperature control in different regions of the substrate. This segmentation enables precise temperature management while the groove structure prevents direct seal band-substrate contact that causes temperature singularities.

The patent merges the sealing function and the temperature control function into a single integrated structure. The grooves are formed as integral parts of the seal bands, combining the sealing function with the heat transfer channel function. This merging reduces device complexity by eliminating the need for separate sealing components and heat transfer channels, while still achieving temperature uniformity across the substrate.

The seal bands are designed with multi-functionality, serving both as sealing elements and as heat transfer channel structures. The grooves in the seal bands simultaneously provide sealing action and control heat distribution, allowing a single component to perform multiple functions. This universality reduces the overall number of components needed while maintaining temperature uniformity.