Electrostatic Chuck Anodized Plenums Dielectric Layer
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Solution Overview
Problem
Conventional electrostatic chucks in semiconductor processing face issues with arcing due to plasma formation in gas passages, which can damage the chuck and substrate, and are prone to particulate contamination from aluminum surfaces.
Innovation Solution
The design incorporates anodization and ceramic bushings to insulate critical areas, eliminating bare aluminum surfaces and using appropriate helium hole designs to reduce arcing and improve temperature uniformity, along with a dielectric layer to prevent plasma formation and enhance manufacturing and repairability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If gas passages are used for heat transfer in electrostatic chucks, then heat transfer efficiency is improved, but plasma formation and arcing occur in the gas passages
Solution Approach 1:
A dielectric material is introduced as an intermediary substance filling the gas passages. This dielectric material enables heat transfer from the substrate to the chuck body while preventing plasma formation and arcing by blocking the electrical discharge path, thus resolving the contradiction between heat transfer efficiency and plasma prevention
Solution Approach 2:
The electrical properties of the gas passage medium are changed by replacing gas with dielectric material. This parameter change transforms the passage from a plasma-prone environment to a plasma-free environment while maintaining thermal conduction capability, thereby eliminating arcing while preserving heat transfer function
2Ease of manufacture
If bare aluminum surfaces are used in the electrostatic chuck, then manufacturing simplicity is maintained, but arcing occurs and substrate damage is caused
Solution Approach 1:
The chuck structure is transformed from bare aluminum to a composite structure where dielectric material is integrated into the aluminum body at the gas passage locations. This composite design eliminates arcing and substrate damage while maintaining manufacturing feasibility through standard dielectric deposition processes
Solution Approach 2:
Dielectric material serves as an intermediary layer between the aluminum body and the substrate, preventing direct electrical contact and thus eliminating arcing and substrate damage while allowing the aluminum structure to remain for manufacturing simplicity
3Temperature
If gas passages are introduced for thermal control, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
The dielectric material in the gas passages serves multiple functions simultaneously: it acts as a thermal conductor for temperature uniformity, an electrical insulator for plasma prevention, and a structural filler for mechanical integrity. This multi-functionality achieves temperature control while minimizing additional device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces arcing and plasma formation, extending the life of the electrostatic chuck and preventing substrate damage, while improving temperature control and process reliability.
Implementation Method 1
The surfaces of the plenums are anodized; one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated
Implementation Method 2
a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon
Implementation Method 3
Electrostatic chucks utilize capacitive and Johnsen-Rahbeck attractive forces for holding the substrate in position
Implementation Method 4
Electrostatic chucks utilize capacitive and Johnsen-Rahbeck attractive forces for holding the substrate in position
Implementation Method 5
The fluid distribution element includes a plenum that carries the fluid through multiple passages formed in the support surface of the electrostatic chuck for distributing a heat transfer fluid such as a gas between the support surface of the chuck and the backside of the substrate
Implementation Method 6
The gas fills the interstitial area between the electrostatic chuck and the substrate, thus enhancing the rate and uniformity of heat transfer between electrostatic chuck and the substrate
Data Source
AI summary
Electrostatic chucks and methods of manufacturing the same are provided herein. In some embodiments, an electrostatic chuck comprises an electrically conductive body having one or more channels formed in an upper surface thereof; a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized; one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated; and a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon.