Electrostatic Chuck Current Monitoring for Arc Risk Prediction

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Solution Overview

Problem

Electrostatic chucks in semiconductor processing systems degrade due to harsh chemical, electrical, and thermal environments, leading to imbalanced currents and increased propensity for arcing, which causes substrate defects and makes proactive monitoring and servicing challenging.

Innovation Solution

A system that senses currents through electrodes in the electrostatic chuck, generates metrics based on these currents, and predicts health degradation, likelihood of defects, and arcing, using thresholds and statistical analysis to determine the health and remaining useful life of the chuck.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electrostatic chucks are used in harsh chemical, electrical, and thermal environments for substrate processing, then substrate processing capability is maintained, but the electrostatic chuck degrades leading to imbalanced currents and increased arcing propensity

Engineering Contradiction:
Improvesubstrate processing capabilityVSAvoidelectrostatic chuck health
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The system performs preliminary monitoring of current through electrodes before degradation becomes severe. By continuously sensing current and detecting imbalances early, the system can predict potential failures and schedule maintenance proactively, preventing catastrophic breakdown during substrate processing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system establishes a feedback loop by continuously monitoring current through the electrodes, comparing it against reference values, and using the detected imbalances to assess electrostatic chuck health. This feedback mechanism enables real-time evaluation of degradation and predictive maintenance scheduling.

Inventive Principle:
Principle #23Feedback

2Reliability

If continuous monitoring of electrostatic chuck health is implemented, then proactive maintenance is enabled, but system complexity increases

Engineering Contradiction:
Improveelectrostatic chuck health monitoringVSAvoidmonitoring system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The system uses the existing electrodes and current measurement capabilities already present in the electrostatic chuck assembly. By leveraging these existing components for health monitoring, the system avoids adding complex external sensors or measurement devices, thereby minimizing additional system complexity.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The current sensing mechanism serves dual purposes: it performs its original function of measuring current for electrostatic chuck operation while simultaneously serving as a health monitoring sensor. This multi-functionality eliminates the need for separate dedicated health monitoring hardware, reducing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables proactive monitoring and prediction of electrostatic chuck degradation and substrate defects, allowing for planned production and service, thereby reducing substrate non-uniformity and extending the life of the electrostatic chuck.

Implementation Method 1

sense one or more currents through one or more electrodes arranged in the pedestal

Methodology Applied
Scientific EffectElectrical Conduction: Conduction (electrical)

Implementation Method 2

The ESC comprises a plurality of clamping electrodes to clamp the substrate to the ESC during processing

Methodology Applied
Scientific EffectElectrostatic Force: Electrostatics

Implementation Method 3

Plasma is struck between the showerhead and the ESC to deposit material on or to remove (etch) material from the substrate

Methodology Applied
Scientific EffectPlasma: Plasma

Data Source

PatentUS20250022740A1System for monitoring performance of electrostatic chucks in substrate processing systems
Publication Date: 2025.01.16 LAM RES CORP
  • US20250022740A1 patent drawing
  • US20250022740A1 patent drawing
  • US20250022740A1 patent drawing

AI summary

A system for monitoring health of a pedestal of a processing chamber comprises a memory storing instructions and a processor. The processor is configured to execute the instructions to sense one or more currents through one or more electrodes arranged in the pedestal; generate one or more metrics based on the one or more currents; and determine a health of the pedestal based on the one or more metrics.