Electrostatic Chuck Bonding Uniformity via Filling Member
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Solution Overview
Problem
Conventional methods for bonding an electrostatic chuck with a heater pattern to a base member often result in non-uniform thickness of the organic adhesive, leading to uneven distances between the base member and the electrostatic chuck.
Innovation Solution
A bonding method involving the formation of a filling member to cover irregularities on the electrostatic chuck's heater pattern, grinding its base member contact surface, and bonding it to the base member with an adhesive layer, which can include a mixture of resin and ceramic particles for thermal conductivity and breakdown voltage compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If organic adhesive is used to bond the electrostatic chuck to the base member, then bonding is achieved, but the adhesive thickness becomes non-uniform due to heater pattern irregularities
Solution Approach 1:
A filling member is formed on the electrostatic chuck before bonding to the base member. This filling member compensates for surface irregularities of the heater pattern in advance, ensuring uniform adhesive thickness when the base member is bonded afterward.
Solution Approach 2:
A filling member is introduced as an intermediary element between the electrostatic chuck and the base member. This filling member has a planar upper surface that provides a uniform bonding interface, allowing the adhesive to have consistent thickness across the entire bonding area.
2Manufacturing precision
If the heater pattern irregularities are not compensated, then the bonding process is simple, but the distance between base member and electrostatic chuck becomes non-uniform
Solution Approach 1:
The filling member is formed preliminarily on the electrostatic chuck to compensate for heater pattern irregularities before the bonding process. This preliminary action ensures uniform distance between the base member and electrostatic chuck without complicating the subsequent bonding operation.
Solution Approach 2:
The filling member is applied locally only where heater pattern irregularities exist on the electrostatic chuck. This localized compensation maintains uniform distance between the base member and electrostatic chuck while adding minimal complexity to the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures a uniform distance between the base member and the electrostatic chuck, enhancing the uniformity and stability of the bonding process, particularly in substrate processing applications like plasma etching.
Implementation Method 1
The filling member may have thermal conductivity ranging from about 0.2 W/mK to about 30 W/mK
Implementation Method 2
bonding the ground base member contact surface of the filling member to the base member with an adhesive layer provided therebetween
Implementation Method 3
The filling member may be formed by spraying a mixture of resin and ceramic particles onto the bottom surface of the electrostatic chuck
Implementation Method 4
spraying a mixture of resin and ceramic particles onto the bottom surface of the electrostatic chuck, and, then, sintering the sprayed mixture
Data Source
AI summary
A distance between the surface of the base member and the electrostatic chuck having the heater pattern formed on a bottom surface thereof can be uniformized. A bonding method of bonding an electrostatic chuck and a base member to each other includes forming a filling member 30 by covering irregularities of a heater pattern 9a formed on a bottom surface 61 of the electrostatic chuck 9 facing the base member 10; grinding a base member contact surface 62 of the filling member 30 facing the base member 10; and bonding the ground base member contact surface 62 of the filling member 30 to the base member 10 with an adhesive layer 31 provided therebetween.