Electrostatic Chuck Bonding Layer Thickness Control
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Solution Overview
Problem
Existing electrostatic chuck devices face challenges in precisely controlling the thickness of the bonding layer and managing thermal issues due to inconsistent thickness and thermal expansion, leading to uneven bonding and potential damage from stress concentration and thermal contraction.
Innovation Solution
An electrostatic chuck device with a base featuring radially extending protrusions and a bonding agent with high heat conductivity and low thermal expansion, embedded in a thermosetting resin, which allows for precise control of the bonding layer thickness and uniform heating/cooling of specimens, while minimizing stress and thermal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If masking tape or wire is used to control the thickness of the bonding layer, then the bonding process can be performed, but the thickness control becomes inconsistent and challenging
Solution Approach 1:
The invention changes the physical state of the bonding agent from a solid (masking tape or wire) to a liquid that can be precisely applied and controlled. The liquid bonding agent allows for consistent thickness control through controlled application methods, eliminating the variability associated with solid masking materials.
Solution Approach 2:
The invention uses a composite structure consisting of the electrostatic chuck plate, the liquid bonding agent layer, and the base. This composite approach allows each layer to contribute its specific properties: the electrostatic chuck plate provides adsorption functionality, the liquid bonding agent provides consistent bonding with controlled thickness, and the base provides structural support.
2Strength
If a bonding agent is used to bond the electrostatic chuck plate to the base, then bonding can be achieved, but thermal expansion differences may cause inconsistent thickness and thermal issues
Solution Approach 1:
The invention selects a bonding agent with specific thermal properties (thermal expansion coefficient and heat conductivity) that match or are compatible with the electrostatic chuck plate and base materials. This parameter matching ensures that thermal expansion differences are minimized, preventing inconsistent thickness and thermal issues during bonding and operation.
3Device complexity
If the bonding layer thickness is not uniformly controlled, then the bonding process is simpler, but thermal expansion causes stress concentration and potential damage
Solution Approach 1:
The invention uses the liquid state of the bonding agent to achieve uniform thickness control through controlled application. The liquid can be evenly distributed across the bonding surface, ensuring consistent thickness that prevents stress concentration during thermal expansion and contraction, thereby improving reliability without significantly complicating the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise control of the bonding layer thickness and uniform temperature distribution, reducing stress and thermal damage, thus ensuring consistent bonding and efficient heat transfer across a wide temperature range.
Implementation Method 1
an electrostatic chuck plate configured to adsorb a specimen such as a wafer using an electrostatic force
Implementation Method 2
a bonding agent which bonds the electrostatic chuck plate to the base... heat conductivity of the base may be 50 W/(mK) or higher
Data Source
AI summary
The present disclosure provides an electrostatic chuck device capable of uniformly cooling or heating a fixedly adsorbed substrate. The electrostatic chuck device includes an electrostatic chuck plate, a bonding layer, and a base. The bonding layer has a bonding agent bonded to a rear surface of the electrostatic chuck plate. The base has a bonding surface bonded to the bonding layer and a plurality of protrusions radially extending from a central part toward an outer circumferential surface of the bonding surface. The ends of the respective protrusions on the central part may be arranged at intervals.