Electrostatic Chuck Bonding Structure for Uniform Wafer Temperature
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The substrate fixing device experiences variations in heat generation density on the electrostatic chuck's substrate placement surface, leading to temperature variations and decreased yield in semiconductor elements during plasma etching.
Innovation Solution
A substrate fixing device is designed with a base plate, an electrostatic chuck having a recess and an electronic component accommodated within, and an adhesive layer that bonds the base plate and electrostatic chuck. The electrostatic chuck includes a resin layer with a filling portion and a protruding portion that contacts the base plate, ensuring uniform adhesive layer thickness and improved temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electrostatic chuck is used to attract and hold the substrate, then the substrate can be securely fixed for plasma etching, but variation in heat generation density occurs on the substrate placement surface causing temperature non-uniformity
Solution Approach 1:
The invention introduces a recess in the electrostatic chuck at the position corresponding to the heating element, creating a localized structural modification. This recess reduces the heat generation density at the heating element position, compensating for the excessive heat concentration and achieving more uniform temperature distribution across the substrate placement surface while maintaining secure substrate fixation
2Extent of automation
If electronic components are mounted on the electrostatic chuck, then the chuck can be controlled, but the components cause local heat concentration and temperature variation
Solution Approach 1:
The invention places electronic components inside a recess formed in the electrostatic chuck. This nested structure allows the components to be accommodated within the chuck body rather than being mounted on the substrate placement surface. The recess design ensures that the electronic components do not interfere with substrate placement while their presence does not cause additional temperature non-uniformity, as the recess already serves to reduce heat concentration
3Strength
If adhesive layer is used to bond the electrostatic chuck to the base plate, then the components are fixed, but the adhesive layer thickness variation causes temperature non-uniformity
Solution Approach 1:
The invention forms a recess in the electrostatic chuck before bonding it to the base plate. This pre-formed recess serves as a spacer that maintains a consistent gap between the electrostatic chuck and the base plate, ensuring uniform adhesive layer thickness. The recess acts as a mechanical stop that prevents the adhesive layer from becoming too thick in certain areas, thereby ensuring uniform heat conduction and temperature distribution across the substrate placement surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration achieves improved uniformity of temperature on the substrate placement surface, preventing variations in etching rates and enhancing the yield of semiconductor elements.
Implementation Method 1
an electrostatic chuck having a substrate placement surface on which a substrate is placed and a second bonding surface provided on a side opposite to the substrate placement surface, and configured to attract and hold the substrate
Implementation Method 2
an adhesive layer configured to bond the first bonding surface of the base plate and the second bonding surface of the electrostatic chuck
Data Source
AI summary
A substrate fixing device includes a base plate having a first bonding surface, an electrostatic chuck having a substrate placement surface on which a substrate is placed and a second bonding surface provided on a side opposite to the substrate placement surface, and configured to attract and hold the substrate, and an adhesive layer configured to bond the first bonding surface of the base plate and the second bonding surface of the electrostatic chuck. The electrostatic chuck includes a recess provided in the second bonding surface, an electronic component accommodated in the recess, and a layer having a filling portion configured to fill the recess and a protruding portion protruding from the recess and having a tip end in contact with the first bonding surface.