Electrostatic Chuck Channels for Symmetric Grounding and Lower Capacitance
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Solution Overview
Problem
Conventional semiconductor substrate supports face challenges in achieving symmetric grounding and reducing electrical losses between electrodes while maintaining a specified thickness, which affects processing quality and efficiency.
Innovation Solution
Incorporating channels within the electrostatic chuck body to increase the volume percentage of air or fluid between electrodes, reducing effective capacitance without increasing thickness, and maintaining structural and thermal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the distance between electrode and ground electrode is increased to reduce capacitance, then electrical losses are reduced, but the substrate support thickness increases
Solution Approach 1:
The substrate support incorporates a porous dielectric material with controlled porosity (30-70%) between the electrode and ground electrode. The porous structure reduces the effective capacitance by introducing air voids that have lower permittivity than the solid dielectric material, thereby reducing electrical losses without requiring increased thickness.
Solution Approach 2:
The invention changes the physical parameters of the dielectric material by controlling its porosity and pore size distribution. By adjusting the porosity parameter within the 30-70% range and controlling pore sizes between 10-500 micrometers, the effective capacitance is reduced while maintaining the same substrate support thickness, thus reducing electrical losses without increasing dimensions.
2Loss of energy
If channels are incorporated to reduce capacitance, then electrical losses are reduced, but device complexity increases
Solution Approach 1:
Rather than incorporating complex channels, the invention uses a uniformly porous dielectric material that simplifies the structure. The porous material is formed as a homogeneous layer between the electrode and ground electrode, eliminating the need for complex channel networks while achieving the same capacitance reduction effect.
Solution Approach 2:
The invention merges the functions of capacitance reduction and dielectric insulation into a single porous dielectric layer. This consolidation eliminates the need for separate channel structures and multiple components, reducing device complexity while maintaining the ability to reduce electrical losses through controlled porosity.
3Loss of energy
If porosity is increased to reduce effective capacitance, then electrical losses are reduced, but structural integrity may deteriorate
Solution Approach 1:
The invention uses specifically engineered porous dielectric materials that maintain structural integrity despite high porosity (30-70%). The porous structure is formed with controlled pore sizes (10-500 micrometers) and distributed uniformly, providing mechanical support while reducing effective capacitance. The dielectric material's inherent strength compensates for the porosity, preventing structural deterioration.
Solution Approach 2:
The substrate support employs a composite structure combining the porous dielectric material with the surrounding solid substrate support structure. This composite approach allows the porous layer to reduce capacitance while the solid composite structure maintains overall structural integrity and mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces electrical losses and improves capacitance symmetry, enhancing processing quality and efficiency by minimizing stray plasma formation and maintaining uniform temperature control.
Implementation Method 1
Incorporating channels within the electrostatic chuck body to increase the volume percentage of air or fluid between electrodes, reducing effective capacitance
Implementation Method 2
Aspects related to providing temperature control for a substrate
Implementation Method 3
The assemblies may include a heater embedded within the electrostatic chuck body between the electrode and the ground electrode
Implementation Method 4
Aspects related to providing temperature control for a substrate
Data Source
AI summary
Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface. The support assemblies includes a support stem coupled with the electrostatic chuck body. The support assemblies includes an electrode embedded within the electrostatic chuck body proximate the substrate support surface. The support assemblies includes a ground electrode embedded within the electrostatic chuck body. The support assemblies includes one or more channels formed within the electrostatic chuck body between the electrode and the ground electrode.