Electrostatic Chuck Channel Coating for Thermal Uniformity
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Solution Overview
Problem
The existing mounting members for semiconductor and liquid crystal display manufacturing have inefficient heat exchange mechanisms, leading to prolonged time in narrowing temperature distribution across wafers during exposure processes.
Innovation Solution
An electrostatic chuck with a laminate structure comprising insulating layers and metallic films with high thermal conductivity, where channels are lined with metallic films to enhance heat exchange and reduce temperature differences, and heaters are integrated to actively manage temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If channels have uncovered ceramic inner surface, then manufacturing is simpler, but heat exchange efficiency is low
Solution Approach 1:
The patent applies composite materials by coating the inner surface of channels with a material having high thermal conductivity. This creates a composite structure where the ceramic body provides mechanical strength and insulation, while the coating layer enhances heat exchange efficiency. The coating material acts as a thermal bridge between the cooling fluid and the ceramic body, resolving the contradiction between manufacturing simplicity and heat exchange efficiency.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the channel inner surface by applying a coating layer with high thermal conductivity. This parameter change allows the channel to transfer heat more efficiently from the ceramic body to the cooling fluid, thereby reducing the time required to narrow temperature distribution without fundamentally altering the manufacturing process.
2Temperature
If cooling time is extended, then temperature distribution is narrowed, but productivity decreases
Solution Approach 1:
By coating the channel inner surface with high thermal conductivity material, the heat exchange efficiency is significantly improved. This allows the system to achieve better temperature distribution control in shorter time, thereby maintaining productivity while improving temperature uniformity across the wafer.
Solution Approach 2:
The coating layer on the channel inner surface acts as a thermal intermediary, facilitating more efficient heat transfer from the ceramic body to the cooling fluid. This intermediary layer enables faster temperature equalization without requiring extended cooling times, thus maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively narrows the temperature distribution across the wafer in a shorter time, improving the efficiency of heat exchange and reducing the time required to stabilize temperatures during manufacturing processes.
Implementation Method 1
a first layer (42) having a higher thermal conductivity than the body (11) arranged on the inner surface of each channel (40). Through the inner surface of each channel, the fluid flowing in each channel directly exchanges heat with the body
Implementation Method 2
An electrostatic chuck 1, which is a mounting member according to one embodiment, has one main surface serving as a mounting surface 3, on which an object 2 such as a wafer is mounted. The electrostatic chuck 1 attracts the object 2 with an electrostatic force and retains the object 2.
Implementation Method 3
heaters 22 for adjusting the temperature of the mounting surface 3
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A mounting member includes a body having a surface including a mounting surface on which an object is mountable, a channel arranged in the body, and a first layer arranged on an inner surface of the channel. The first layer has a higher thermal conductivity than the body.