Electrostatic Chuck Charge Measurement for Reliable Dechucking
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Solution Overview
Problem
In substrate processing apparatuses, residual charges on electrostatic chucks can cause substrate damage and positioning issues during dechucking, and frequent charge neutralization reduces throughput.
Innovation Solution
A substrate processing apparatus with a charge amount measurement unit, a charge neutralization mechanism, and a retreating mechanism that measures and neutralizes charges on the substrate attraction surface without hindering the treatment process, using a shield member with a sector-shaped opening to accurately detect charge distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If charge neutralization is performed frequently to prevent substrate damage and positioning issues, then substrate processing reliability is improved, but throughput deteriorates due to repeated interruptions
Solution Approach 1:
The charge amount measurement unit measures the charge amount on the mounting table surface in advance before substrate processing. The controller determines whether charge neutralization is needed based on the measured charge amount, allowing neutralization to be performed only when necessary rather than frequently, thus preventing substrate damage while maintaining throughput
Solution Approach 2:
The system continuously monitors the charge amount on the mounting table surface using the measurement unit and adjusts the charge neutralization operation based on the measured values. The controller compares the measured charge amount against thresholds and activates the neutralization mechanism only when the charge amount exceeds acceptable levels, creating a closed-loop control system that optimizes both reliability and productivity
2Measurement precision
If a charge amount measurement unit is positioned facing the substrate attraction surface to accurately measure charge distribution, then measurement precision is improved, but the measurement unit interferes with substrate treatment process
Solution Approach 1:
The measurement unit is configured to move between a measurement position where it faces the substrate attraction surface to accurately measure charge distribution, and a retreated position where it moves away to avoid interfering with substrate treatment. The retreating mechanism enables the measurement unit to dynamically change its position based on whether measurement or processing is the active operation, thus achieving both precise measurement and uninterrupted substrate treatment
Solution Approach 2:
The retreating mechanism acts as an intermediary that coordinates the measurement unit's position. When substrate treatment is ongoing, the retreating mechanism moves the measurement unit away from the processing area. When measurement is required, it positions the measurement unit facing the attraction surface. This intermediary mechanism resolves the conflict between measurement precision and treatment throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate damage and positioning errors by accurately measuring and neutralizing charges on the electrostatic chuck, maintaining throughput by performing charge neutralization only when necessary.
Implementation Method 1
a mounting table disposed in the processing chamber and configured to attract and hold the substrate using an electrostatic attractive force
Implementation Method 2
a charge amount measurement unit disposed in the processing chamber and configured to measure charge amount of a substrate attraction surface of the mounting table
Implementation Method 3
a charge neutralization mechanism configured to neutralize the substrate attraction surface of the mounting table
Data Source
AI summary
In a substrate processing apparatus for processing a substrate, a processing chamber accommodating the substrate is provided. A mounting table is disposed in the processing chamber and configured to attract and hold the substrate using an electrostatic attractive force. A charge amount measurement unit is disposed in the processing chamber and configured to measure charge amount of a substrate attraction surface of the mounting table. A charge neutralization mechanism is configured to neutralize the substrate attraction surface of the mounting table. A retreating mechanism is configured to make the charge amount measurement unit retreat from a measurement position facing the substrate attraction surface of the mounting table.


