Electrostatic Chuck Temperature Control for Charge Removal
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Solution Overview
Problem
Existing substrate processing methods face inefficiencies in charge removal from substrates due to residual charges, which can lead to substrate damage and decreased throughput, as the temperature control of electrostatic chucks is not optimized for effective charge transfer.
Innovation Solution
A substrate processing method that adjusts the surface temperature of the electrostatic chuck based on pre-measured relationships between maximum surface temperature and residual charge amount, ensuring efficient charge removal by heating the chuck to a charge removal temperature that balances efficient charge transfer with maintaining attraction characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrostatic chuck is heated to a high surface temperature to remove residual charge from the substrate, then the charge removal efficiency is improved, but the substrate attraction characteristics deteriorate
Solution Approach 1:
The electrostatic chuck dynamically adjusts its surface temperature based on the operational phase: heated to a higher temperature during charge removal to enhance charge transfer, and maintained at a lower temperature during substrate processing to ensure stable attraction. This temporal dynamic adjustment resolves the contradiction between charge removal efficiency and attraction characteristics.
Solution Approach 2:
The electrostatic chuck operates in periodic cycles alternating between charge removal mode (higher temperature) and substrate processing mode (lower temperature). This periodic temperature variation allows the system to optimize for charge removal during specific time intervals while maintaining attraction characteristics during processing intervals, eliminating the need to permanently compromise either function.
2Reliability
If the electrostatic chuck temperature is increased to enhance charge transfer, then the residual charge amount is reduced, but the energy consumption increases
Solution Approach 1:
The electrostatic chuck employs periodic heating cycles rather than continuous heating, raising temperature only during charge removal phases and maintaining lower temperatures during substrate processing. This periodic action significantly reduces overall energy consumption while achieving effective charge removal when needed.
Solution Approach 2:
The system performs charge removal as a preliminary action before substrate processing by heating the chuck to a higher temperature. By removing charges beforehand, the system avoids the need for continuous high-temperature operation during processing, thereby reducing total energy consumption while maintaining charge removal efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively removes residual charges from substrates, preventing damage and ensuring high throughput by optimizing the temperature of the electrostatic chuck for efficient charge removal without compromising its attraction function.
Implementation Method 1
causing a substrate to be attracted to an electrostatic chuck
Implementation Method 2
adjusting a surface temperature of the electrostatic chuck to be greater than or equal to the determined charge removal temperature
Data Source
AI summary
A substrate processing method is provided. The method includes a) causing a substrate to be attracted to an electrostatic chuck, and b) processing the substrate. The method includes c) determining a charge removal temperature based on information preliminarily stored in a storage, thereby adjusting a surface temperature of the electrostatic chuck to be greater than or equal to the determined charge removal temperature, the information indicating a relationship between a maximum surface temperature of the electrostatic chuck, during substrate processing, and a residual charge amount for the processed substrate. The method includes d) removing a charge from the processed substrate.