Electrostatic Chuck Cleaner with Adhesive and Conductive Layers
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Solution Overview
Problem
In exposure apparatuses using EUV light, foreign matters on the electrostatic chuck can cause reticle deformation and pattern distortion, and existing cleaning methods either fail to remove these contaminants effectively or require opening the vacuum environment, reducing operational efficiency.
Innovation Solution
An electrostatic chuck cleaner with substrates having alternating adhesive and conductive layers is used to press and remove foreign matters from the electrostatic chuck's adsorption face, ensuring uniform contact and efficient cleaning without exposing the vacuum to atmosphere.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing cleaning methods are used to remove foreign matters from the electrostatic chuck, then cleaning effectiveness is reduced, but if stronger cleaning methods are applied, then the vacuum environment must be opened, reducing operational efficiency
Solution Approach 1:
The cleaning substrate is divided into multiple regions with different functional layers: adhesive layers for capturing foreign matters, conductive layers for electrostatic attraction, and insulating layers for electrical isolation. This segmentation allows each region to perform its specific function effectively while maintaining the overall cleaning capability within the vacuum environment.
Solution Approach 2:
The invention changes the physical and chemical parameters of the cleaning substrate by using materials with specific adhesive properties, electrical conductivity, and mechanical flexibility. The adhesive layers are designed with controlled adhesion strength to capture foreign matters effectively, while the conductive layers are configured to provide appropriate electrostatic attraction forces without requiring vacuum breach.
2Reliability
If adhesive layers are applied uniformly across the cleaning substrate, then foreign matters can be removed, but uniform contact with the electrostatic chuck surface is difficult to achieve
Solution Approach 1:
The cleaning substrate employs local quality by providing different layers in different regions: adhesive layers in contact regions for foreign matter capture, conductive layers in specific patterns for electrostatic attraction, and insulating layers for electrical isolation. This regional differentiation ensures that each area of the substrate performs its intended function optimally.
Solution Approach 2:
The cleaning substrate is designed to be flexible and adaptable, allowing it to conform to the electrostatic chuck surface geometry. The alternating layer structure provides mechanical compliance that enables uniform contact across the curved or irregular surface of the electrostatic chuck, ensuring consistent cleaning performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaner effectively removes foreign matters from the electrostatic chuck's surface, maintaining the vacuum environment and preventing reticle deformation, thus enhancing the operational efficiency of EUV exposure processes.
Implementation Method 1
a plurality of substrates 10a and 10b each having: adhesive layers 20 provided on a major surface 10as; and conductive layers 30 provided on the major surface 10as and provided in a region other than a region where the adhesive layer 20 is provided
Data Source
AI summary
According to one embodiment, an electrostatic chuck cleaner cleaning an adsorption face of an electrostatic chuck capable of attracting a reticle, and the cleaner includes: a plurality of substrates; adhesive layers provided on a major surface of each of the substrates, the adhesive layers being pressed against the adsorption face; and conductive layers provided on the major surface of each of the substrates, and the conductive layers being provided in a region other than a region where the adhesive layer being provided. The adhesive layers provided on the major surface of each of the substrates are disposed in different regions, and the entire adsorption face is pressed by the adhesive layers when the adhesive layers of the substrates are pressed against the adsorption face.