Electrostatic Chuck Concentric Heater Zones for Substrate Temperature Uniformity
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Solution Overview
Problem
As semiconductor devices shrink, there is a need for uniform substrate processing, particularly in controlling substrate temperature to prevent nonuniform deposition or removal of material, which can lead to suboptimal or non-functional devices.
Innovation Solution
An electrostatic chuck with a puck of dielectric material and concentric heater elements provides independent temperature control zones to maintain a uniform temperature profile across the substrate, compensating for temperature non-uniformities within the process chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heating methods are used in a process chamber, then the substrate can be heated, but temperature non-uniformity occurs across the substrate surface
Solution Approach 1:
The heating system is segmented into multiple independent heater zones (e.g., central zone, intermediate zone, peripheral zone) that can be controlled separately. Each zone has its own heating power control, allowing independent temperature adjustment to compensate for non-uniform heat distribution and achieve uniform substrate temperature.
Solution Approach 2:
Different regions of the substrate receive different heating intensities according to their specific thermal requirements. The central, intermediate, and peripheral zones are heated differently to compensate for edge effects and achieve overall temperature uniformity across the substrate surface.
2Manufacturing precision
If multiple heater zones are added to improve temperature uniformity, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heater zones share common structural support and control architecture, allowing them to function as both individual heating elements and as a unified temperature control system. The control unit can manage all zones through a standardized interface, reducing the complexity increase that would normally result from multiple independent systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures improved temperature control and uniformity during semiconductor processing, enhancing the performance and reliability of fabricated devices by dynamically managing heat distribution across the substrate.
Implementation Method 1
energizing an electrode to electrostatically retain a substrate upon a surface of an electrostatic chuck
Implementation Method 2
applying power to a heater disposed within the electrostatic chuck, wherein the heater comprises a plurality of concentric heater elements
Data Source
AI summary
Methods and apparatus for controlling the temperature of a substrate during processing are provided herein. In some embodiments, an apparatus for retaining and controlling substrate temperature may include a puck of dielectric material; an electrode disposed in the puck proximate a surface of the puck upon which a substrate is to be retained; and a plurality of heater elements disposed in the puck and arranged in concentric rings to provide independent temperature control zones.