Electrostatic Chuck Cooling with Periodic Coolant Flow Control
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Solution Overview
Problem
The existing cooling systems for semiconductor equipment face challenges in maintaining temperature uniformity of wafers due to temporal and spatial changes in coolant temperature, which affects the consistency of process results.
Innovation Solution
A cooling system for semiconductor equipment that includes a chamber, an electrostatic chuck, a coolant pipe housing, and a coolant pipe with a flow controller to periodically adjust the flow velocity of the coolant, ensuring it reaches both highest and lowest speeds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If coolant flow velocity is increased to improve cooling efficiency, then cooling ability improves, but temperature uniformity of the wafer deteriorates due to temporal and spatial temperature changes in the coolant
Solution Approach 1:
The patent applies periodic action by controlling the coolant flow velocity to vary periodically over time rather than maintaining a constant high velocity. The flow controller adjusts the coolant flow in periodic cycles, allowing the coolant to maintain better thermal contact with the wafer during low-velocity phases while still providing effective cooling during high-velocity phases, thereby resolving the contradiction between cooling efficiency and temperature uniformity
2Speed
If coolant temperature changes rapidly to respond to process requirements, then temperature control responsiveness improves, but spatial temperature consistency deteriorates leading to degraded process result uniformity
Solution Approach 1:
The periodic control of coolant flow velocity enables the system to rapidly respond to temperature control requirements while maintaining spatial consistency. During periods of higher velocity, the coolant can quickly absorb heat and respond to temperature changes, while periodic lower velocity periods allow for more uniform heat distribution across the wafer surface, preventing spatial temperature inconsistencies
3Temperature
If constant high flow velocity is used to maintain cooling efficiency, then cooling performance is maintained, but energy consumption increases and temperature uniformity decreases
Solution Approach 1:
By implementing periodic variation in coolant flow velocity, the system maintains effective cooling performance through high-velocity phases while reducing energy consumption during low-velocity phases. This periodic modulation allows the cooling system to achieve the required cooling effect without continuously operating at maximum flow velocity, thereby reducing overall energy consumption while preserving cooling performance
Solution Approach 2:
The system changes the flow velocity parameter periodically rather than maintaining a constant high value. This parameter modulation allows the coolant to deliver effective cooling when needed while consuming less energy during periods when maximum cooling capacity is not required, resolving the contradiction between maintaining cooling performance and reducing energy loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves temperature uniformity of the wafer by optimizing the coolant flow velocity, leading to enhanced consistency and efficiency in semiconductor processing.
Implementation Method 1
the temperature of the coolant gradually changes temporally and spatially along a coolant flow path due to heat exchange with a target object
Implementation Method 2
an electrostatic chuck in the chamber
Data Source
AI summary
A cooling system for semiconductor equipment includes a chamber, an electrostatic chuck in the chamber, a coolant pipe housing in at least one of the chamber and the electrostatic chuck, the coolant pipe housing having an internal space, a coolant pipe at least partially in the internal space of the coolant pipe housing, and a flow controller configured to control a flow velocity of the coolant flowing along the coolant pipe so that the flow velocity periodically reaches a highest speed and a lowest speed.