Electrostatic Chuck Coolant Path Layout for Uniform Wafer Temperature
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Solution Overview
Problem
Manufacturing fluctuations in the position of coolant flow paths in electrostatic chucks can lead to deviations in temperature distribution on the placement surface, compromising the design accuracy.
Innovation Solution
The electrostatic chuck features a communicating path with alternating convex and concave portions on its side surfaces, arranged in a specific direction to minimize deviations in temperature distribution even when the coolant flow path position deviates from the design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional coolant flow path is used in the base plate, then the manufacturing process is simple, but manufacturing fluctuations cause deviations in temperature distribution on the placement surface
Solution Approach 1:
The communicating path incorporates convex and concave portions at specific locations (radially outward side) to create localized thermal management zones. These geometric variations modify coolant flow characteristics and heat dissipation patterns in specific regions, compensating for manufacturing position deviations and maintaining uniform temperature distribution across the placement surface.
Solution Approach 2:
The invention introduces geometric complexity in the radial dimension by adding convex and concave portions to the communicating path. This dimensional modification allows the system to compensate for manufacturing errors in the axial direction (flow path position), effectively using one dimension to correct issues in another dimension.
2Manufacturing precision
If the coolant flow path position is precisely controlled during manufacturing, then temperature distribution accuracy is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The convex and concave portions in the communicating path serve as pre-designed compensation features that cushion against the harmful effects of manufacturing position deviations. By incorporating these geometric variations beforehand, the system becomes tolerant to flow path position fluctuations, eliminating the need for extremely precise manufacturing controls.
3Ease of manufacture
If the communicating path has a simple linear structure, then the device is easier to manufacture, but temperature distribution deviations occur when flow path position varies
Solution Approach 1:
The communicating path incorporates convex and concave portions at specific locations (radially outward side) to create localized thermal management zones. These geometric variations modify coolant flow characteristics and heat dissipation patterns in specific regions, compensating for manufacturing position deviations and maintaining uniform temperature distribution across the placement surface.
Solution Approach 2:
The invention introduces geometric complexity in the radial dimension by adding convex and concave portions to the communicating path. This dimensional modification allows the system to compensate for manufacturing errors in the axial direction (flow path position), effectively using one dimension to correct issues in another dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses deviations in temperature distribution on the placement surface, ensuring consistent performance despite manufacturing misalignments.
Implementation Method 1
the electrostatic chuck applies an electrostatic clamping power to embedded electrodes and clamps a substrate such as a silicon wafer or the like by an electrostatic force
Implementation Method 2
A coolant flow path may be provided in the base plate to cool the process object
Implementation Method 3
The base plate supports the ceramic dielectric substrate. The base plate has an upper surface at the ceramic dielectric substrate side, and a lower surface opposite to the upper surface
Data Source
AI summary
An electrostatic chuck includes a ceramic dielectric substrate and a base plate. The base plate includes a communicating path configured to allow a coolant to pass. The communicating path includes a first flow path part located in an outer circumferential region outside the radial center of the base plate and having a pair of side surfaces along a first direction. The first direction is along a flow of the coolant. When viewed along a stacking direction, one side surface of the pair of side surfaces includes a plurality of convex portions and a plurality of concave portions. The plurality of convex portions is convex in a second direction perpendicular to the first direction. The second direction is from the other side surface toward the one side surface of the pair of side surfaces. The plurality of concave portions is convex in an opposite direction of the second direction.