Electrostatic Chuck Coolant Layout for Uniform Wafer Temperature
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Solution Overview
Problem
Existing electrostatic chucks fail to adequately suppress variations in the in-plane temperature of wafers during processing, despite efforts to uniformize coolant flow paths.
Innovation Solution
The electrostatic chuck incorporates a coolant flow path design with a first and second flow path connected in series, where the second flow path is positioned closer to the target to be cooled, forming a flattened portion to enhance localized cooling and reduce temperature variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a coolant flow path is designed to uniformize in-plane temperature distribution, then temperature uniformity improves, but cooling efficiency at critical locations deteriorates
Solution Approach 1:
The coolant flow path is designed with different characteristics in different regions: the first flow path has a larger cross-sectional area for general temperature uniformity, while the second flow path has a smaller cross-sectional area positioned closer to the dielectric substrate to provide intensive localized cooling at critical hot spots, achieving both uniformity and efficient cooling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses in-plane temperature variations during processing by efficiently cooling critical areas, ensuring uniform temperature distribution across the wafer.
Implementation Method 1
a coolant flow path through which a coolant flows is formed inside the base plate
Implementation Method 2
a coolant flow path through which a coolant flows is formed inside the base plate
Implementation Method 3
When a voltage is applied to the attraction electrode, an electrostatic force is generated, and the wafer placed on the dielectric substrate is attracted and held
Data Source
AI summary
An electrostatic chuck 10 includes a dielectric substrate 100 including a placement surface and a base plate 200 which is joined to the dielectric substrate 100 and which has formed therein a coolant flow path 400 through which a coolant flows. The coolant flow path 400 includes a first flow path 410 and a second flow path 420 connected in series to each other. The second flow path 420 is formed in a position on the dielectric substrate 100 side relative to the first flow path 410 in a direction perpendicular to the placement surface.