Electrostatic Chuck Cooling Flow Path Segmentation
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Solution Overview
Problem
Conventional electrostatic chucks experience non-uniform cooling gas distribution and frequent plasma discharge issues due to asymmetric cooling gas hole arrangements and lack of insulation around cooling gas holes, leading to problems in semiconductor processes like plasma discharge, PR burning, and under etching.
Innovation Solution
An electrostatic chuck with a new cooling flow path pattern and optimized number of cooling gas holes, featuring an insulating structure around the cooling gas holes to ensure uniform gas distribution and prevent plasma discharge, achieved through a multi-layered design with an inlet moving pattern and insulating members to manage the flow and position of cooling gas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single first cooling gas hole is connected to the outer flow path pattern at the outer edge region, then the device complexity is reduced, but the uniformity of cooling gas distribution deteriorates
Solution Approach 1:
The invention divides the cooling gas distribution system into multiple independent flow path patterns (outer flow path pattern and inner flow path pattern), each with multiple first cooling gas holes connected to the cooling gas inlet. This segmentation allows each pattern to independently distribute cooling gas to different regions, ensuring uniform distribution without requiring a single complex hole arrangement.
Solution Approach 2:
The invention creates different flow path patterns with different numbers of first cooling gas holes distributed at different locations (outer region and inner region) of the base member. Each pattern is optimized for its specific region, with the outer pattern having fewer holes at the periphery and the inner pattern having more holes toward the center, achieving local optimization for uniform overall distribution.
2Ease of manufacture
If cooling gas holes are formed without insulating structures, then the ease of manufacture is improved, but plasma discharge phenomena occur frequently
Solution Approach 1:
The invention introduces an insulating member as an intermediary substance that fills the cooling gas holes in the base member. This insulating member prevents direct contact between the cooling gas and the metal base member, thereby preventing plasma discharge while maintaining the cooling function. The insulating member acts as a mediator between the cooling gas and the conductive base material.
Solution Approach 2:
The invention creates a composite structure by combining the base member material with an insulating material (insulating member) within the cooling gas holes. This composite approach allows the base member to maintain its structural and thermal properties while the insulating component prevents plasma discharge, achieving both manufacturing ease and reliability.
3Device complexity
If the inlet position of cooling gas is fixed, then the device complexity is reduced, but the uniformity of gas flow distribution deteriorates
Solution Approach 1:
The invention segments the cooling gas inlet function into multiple first cooling gas holes distributed across different regions of the base member through the outer and inner flow path patterns. Instead of a single fixed inlet, the cooling gas is distributed through multiple inlet points, which naturally improves flow distribution uniformity without adding complex control mechanisms.
Solution Approach 2:
The invention transitions from a single-point inlet (zero-dimensional) to a distributed multi-point inlet system (two-dimensional distribution across the base member surface). By spreading the inlet positions across different spatial locations and connecting them through flow path patterns, the system achieves uniform gas distribution without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform cooling gas distribution to the substrate and effectively prevents plasma discharge phenomena, enhancing the reliability and efficiency of semiconductor processes.
Implementation Method 1
a cooling structure for uniformly cooling a substrate in a chamber using an external cooling gas
Implementation Method 2
an insulating layer, an electrode layer on the insulating layer, and a dielectric layer on the electrode layer
Implementation Method 3
to fix these substrates using electrostatic force, an electrostatic chuck (ESC) is disposed in a chamber device
Data Source
AI summary
Disclosed is an electrostatic chuck with a cooling structure using a cooling gas. The electrostatic chuck comprises: an electrostatic chuck plate that includes a plurality of first cooling gas holes formed in a first region and a plurality of second cooling gas holes formed in a second region; and a base member that includes a first flow path pattern connected to the plurality of first cooling gas holes, a second flow path pattern connected to the plurality of second cooling gas holes, and an inlet moving pattern changing a position of an inlet of a cooling gas injected into the first flow path pattern.