Electrostatic Chuck Cooling Channel Layout for Wafer Temperature Uniformity
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Solution Overview
Problem
Existing semiconductor manufacturing apparatuses face challenges in achieving uniform temperature distribution across wafers due to in-plane temperature differences, which are exacerbated by high integration demands in semiconductor devices.
Innovation Solution
An electrostatic chuck device with a base part featuring a coolant channel design that includes an outer peripheral channel and an inner peripheral channel spirally extending around the central axis, where the inner peripheral channel's cross-sectional area decreases with distance from the central axis, and the wall portion's radial dimension also decreases, optimizing coolant flow and temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional coolant channel design is used, then the structure is simple, but the in-plane temperature distribution of the wafer cannot be reduced to the desired temperature difference
Solution Approach 1:
The coolant channel is designed with spatially varying cross-sectional areas, where the inner peripheral channel has a larger cross-sectional area near the center and a smaller cross-sectional area near the periphery, while the outer peripheral channel has the opposite configuration. This local variation in channel dimensions optimizes coolant flow distribution to achieve uniform temperature across the wafer surface.
Solution Approach 2:
The coolant channel is divided into two separate peripheral channels (inner and outer) with different flow path configurations. The inner peripheral channel extends spirally around the central axis, while the outer peripheral channel is positioned at a larger radius. This segmentation allows independent optimization of cooling in different radial zones of the electrostatic chuck.
2Temperature
If the inner peripheral channel cross-sectional area is uniform, then the channel is easy to manufacture, but the cooling capacity varies significantly from center to periphery
Solution Approach 1:
The inner peripheral channel is designed with a cross-sectional area that varies continuously along its length, being larger near the central axis and smaller near the periphery. This gradient in cross-sectional area compensates for the natural decrease in cooling effectiveness with increasing radius, achieving uniform temperature distribution while maintaining manufacturability through standardized forming processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances temperature uniformity by actively cooling the wafer region, reducing temperature gradients and improving cooling capacity, thereby ensuring consistent processing conditions for highly integrated semiconductor devices.
Implementation Method 1
a coolant channel extending along the support surface is provided inside the base part
Implementation Method 2
a base part which supports the electrostatic chuck part on a support surface thereof from an opposite side of the mounting surface
Implementation Method 3
a plate-shaped electrostatic chuck part which has an electrostatic adsorption electrode provided therein
Data Source
AI summary
An electrostatic chuck device comprising: a plate-shaped electrostatic chuck part which has an electrostatic adsorption electrode provided therein and has a mounting surface on which a plate-shaped sample is mounted; and a base part which supports the electrostatic chuck part on a support surface thereof from an opposite side of the mounting surface, wherein the base part has a disk shape which has a central axis at a center thereof, and a coolant channel extending along the support surface is provided inside the base part, wherein the coolant channel includes an outer peripheral channel which overlaps an outer edge of the plate-shaped sample when viewed from an axial direction of the central axis, and an inner peripheral channel which is disposed on an inner side in a radical direction than the outer peripheral channel, wherein at least a portion of the inner peripheral channel extends spirally around the central axis, and a channel cross-sectional area of the inner peripheral channel decreases as a distance from the central axis increases.