Electrostatic Chuck Cooling Path With Inclined Introduction Portion
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Solution Overview
Problem
Temperature unevenness in the cooling path of an electrostatic chuck can lead to uneven temperature distribution on the substrate, causing variations in the etching rate in plasma etching apparatuses and affecting the yield of semiconductor devices.
Innovation Solution
An electrostatic chuck design featuring a base member with a cooling path that includes an inclined introduction portion and a discharge portion, connected through a conduit, which helps to evenly distribute the cooling medium across the base plate, reducing temperature variations by optimizing the flow path and heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional cooling path with vertical introduction portion is used, then the structure is simple and easy to manufacture, but temperature unevenness occurs on the substrate
Solution Approach 1:
The introduction portion is designed with an inclined shape rather than a vertical symmetric structure. The inclination angle is set to allow the cooling medium to flow along the inclined surface, which promotes more uniform temperature distribution across the base plate by preventing direct impingement and creating a more distributed cooling pattern.
Solution Approach 2:
The cooling path is extended into the thickness direction of the base plate by creating an inclined introduction portion. This adds a dimensional element to the cooling medium flow path, allowing the cooling effect to be distributed more uniformly across the base plate surface rather than concentrating at a single point.
2Temperature
If the cooling medium flows directly into the conduit, then the cooling efficiency is high, but temperature unevenness is caused on the substrate
Solution Approach 1:
The cooling medium is made to flow along the inclined introduction portion before entering the horizontal conduit. This preliminary flow path allows the cooling medium to distribute its cooling effect gradually across the base plate thickness direction, preventing direct concentrated cooling that would cause temperature unevenness while maintaining overall cooling efficiency.
Solution Approach 2:
The inclined introduction portion acts as an intermediary structure between the cooling medium inlet and the horizontal conduit. It mediates the cooling medium flow by creating a gradual transition path that distributes the cooling effect uniformly, preventing direct impingement while maintaining cooling efficiency through controlled flow distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces temperature unevenness on the substrate, enhancing the uniformity of the etching process and improving the yield of semiconductor devices by maintaining consistent temperature adjustments.
Implementation Method 1
The cooling medium flows in the cooling path formed in the base plate. The temperature of the substrate attracted onto an upper surface of the electrostatic chuck substrate is adjusted by a cooling medium and the heating element.
Implementation Method 2
The cooling medium is introduced from an outside of the base member to the introduction portion. The cooling medium is discharged from the discharge portion to the outside of the base member.
Implementation Method 3
The electrostatic chuck substrate includes an electrode and a heating element. The electrode attracts a substrate.
Implementation Method 4
The heating element controls the temperature of an object to be attracted (for example, a substrate).
Data Source
AI summary
An electrostatic chuck includes a base member and an electrostatic chuck substrate. The base member includes a cooling path. The electrostatic chuck substrate is connected to an upper surface of the base member through an adhesive layer so as to attract a substrate to be mounted. The cooling path includes an introduction portion, a discharge portion and a conduit. The cooling medium is introduced from an outside of the base member to the introduction portion. The cooling medium is discharged from the discharge portion. The conduit includes a start end portion communicating with the introduction portion and a final end portion communicating with the discharge portion. The introduction portion is inclined toward a lower surface of the base member and at a predetermined angle with respect to an axis perpendicular to the upper surface. The introduction portion extends from the lower surface toward the start end portion.