Electrostatic Chuck Segmented Cooling Plates
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Solution Overview
Problem
Existing electrostatic chucks have a fixed cooling capacity, which limits their ability to adjust cooling based on temperature demands during substrate processing, affecting processing efficiency.
Innovation Solution
The electrostatic chuck design includes a ceramic plate with a substrate supporting surface and a cooling assembly comprising multiple cooling plates, allowing for adjustable cooling capacity by independently controlling inner and outer regions, and using upper and lower cooling plates to modulate heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling plate is used in the electrostatic chuck, then the device complexity is reduced, but the adaptability of temperature control is worsened
Solution Approach 1:
The cooling assembly is segmented into multiple cooling plates (first cooling plate, second cooling plate, third cooling plate) that can be independently controlled. Each cooling plate can be selectively activated or deactivated based on the specific temperature control requirements of the substrate processing, enabling variable cooling capacity without excessive complexity.
Solution Approach 2:
The cooling assembly transitions from a static, fixed-capacity design to a dynamic, variable-capacity design. The multiple cooling plates can be independently controlled to adjust the overall cooling capacity according to real-time temperature demands during substrate processing, making the system adaptable to different processing conditions.
2Adaptability or versatility
If multiple cooling plates are used to adjust cooling capacity, then the adaptability of temperature control is improved, but the device complexity increases
Solution Approach 1:
The cooling function is divided into multiple independent cooling plates, each capable of being controlled separately. This segmentation allows the system to achieve variable cooling capacity by selectively activating specific cooling plates, providing adaptability without requiring a completely complex redesign of the entire cooling system.
Solution Approach 2:
The multiple cooling plates serve universal cooling functions but with different capacities and zones. They can be used individually or in combination, allowing the same cooling assembly structure to handle various temperature control scenarios from low to high cooling demands, reducing the need for multiple specialized systems.
3Device complexity
If fixed cooling capacity is used, then the device complexity is reduced, but the productivity of substrate processing is worsened
Solution Approach 1:
The cooling capacity becomes dynamic rather than fixed, allowing real-time adjustment during substrate processing. This enables the system to respond to changing temperature demands without interrupting the processing workflow, thereby improving substrate processing efficiency while maintaining reasonable system complexity.
Solution Approach 2:
The cooling capacity parameter can be changed by selectively activating or deactivating different cooling plates. This allows the system to optimize cooling performance for different substrate sizes, materials, and processing conditions, improving overall processing productivity without requiring a fundamentally complex control system.
4Measurement precision
If variable cooling capacity is implemented, then the temperature control precision is improved, but the device complexity increases
Solution Approach 1:
By segmenting the cooling assembly into multiple independently controllable cooling plates, the system can precisely control temperature in different zones and at different levels. This segmentation enables fine-tuned temperature control precision while keeping each individual cooling plate's structure relatively simple.
Solution Approach 2:
The system can apply partial cooling action by activating only the necessary cooling plates based on the specific temperature control needs. This avoids the complexity of fully activating all cooling plates continuously, allowing precise temperature control with optimized resource usage and reduced operational complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances substrate processing by preventing arcing and allowing for controllable chucking power distribution, supporting substrates at high temperatures, and accommodating larger diameters, thereby improving processing efficiency and temperature control.
Implementation Method 1
a cooling assembly including a plurality of cooling plates disposed below the electrostatic chuck to adjust the cooling capacity of the electrostatic chuck
Implementation Method 2
electrostatic chucks may be utilized to secure a substrate to be processed to a substrate support. Elements of an electrostatic chuck may include electrodes to secure the substrate
Data Source
AI summary
Embodiments of an apparatus for controlling a temperature of an electrostatic chuck in a process chamber are provided herein. In some embodiments, the apparatus includes an electrostatic chuck disposed in a process chamber, the electrostatic chuck including a ceramic plate having a substrate supporting surface, and a cooling assembly including a plurality of cooling plates disposed below the electrostatic chuck to adjust the cooling capacity of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an inner cooling plate configured to control a temperature of a center portion of the electrostatic chuck, and an outer cooling plate configured to control a temperature of an outer portion of the electrostatic chuck. In some embodiments, the plurality of cooling plates includes an upper cooling plate that contacts a bottom surface of the electrostatic chuck, and a lower cooling plate which contacts a bottom surface of the upper cooling plate.