Electrostatic Chuck Cooling Ring for Deposition Heat Management
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Solution Overview
Problem
Conventional high temperature substrate support chucks are inadequate for controlling heat input during lengthy processes like LED backside deposition and MEMS processes, as they exceed the chuck's thermal management capabilities.
Innovation Solution
An electrostatic chuck with a cooling ring assembly that includes a cooling section with a channel and a cap to seal it, thermally coupled to the chuck, allowing for efficient heat removal from the substrate during high-energy processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional high temperature substrate support chucks are used for lengthy heavy deposition rate processes, then deposition rate is improved, but heat input to the wafer and chuck exceeds thermal management capabilities
Solution Approach 1:
The substrate support chuck is segmented into multiple functional zones: an electrostatic chuck region for substrate holding and a cooling ring assembly region for thermal management. The cooling ring assembly is further segmented into multiple cooling channels arranged in series, allowing progressive heat removal from different radial zones of the chuck. This segmentation enables independent optimization of deposition rate (via electrostatic chuck heating) and thermal management (via cooling ring cooling channels).
Solution Approach 2:
A cooling ring assembly acts as an intermediary thermal management component between the electrostatic chuck and the substrate processing environment. The cooling ring receives coolant through inlet ports and distributes it through internal cooling channels, absorbing excess heat from the electrostatic chuck before it transfers to the substrate. This intermediary structure enables high deposition rates by removing heat that would otherwise accumulate during lengthy heavy deposition processes.
2Temperature
If cooling channels are added to the chuck to improve heat removal, then thermal management is improved, but device complexity increases
Solution Approach 1:
The cooling ring assembly is merged with the electrostatic chuck to form an integrated substrate support system. The cooling ring shares the same structural footprint and mounting interface as the electrostatic chuck, eliminating the need for separate cooling components. The cooling channels are integrated into the cooling ring body, and coolant distribution manifolds are combined with the cooling channel structure. This merging reduces device complexity while maintaining effective thermal management.
Solution Approach 2:
The cooling ring assembly serves multiple functions simultaneously: it provides thermal management through cooling channels, structural support for the electrostatic chuck, and coolant distribution through integrated manifolds. The series-arranged cooling channels serve both as heat removal pathways and as structural elements of the cooling ring. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity while improving heat removal capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables processing at lower temperatures, reduces thermal damage, increases deposition rate, and enhances chamber productivity by effectively managing heat during thick film deposition and difficult material sputtering processes.
Implementation Method 1
a cooling section having a top surface thermally coupled to the bottom surface of the electrostatic chuck
Implementation Method 2
a cap coupled to a bottom surface of the cooling section and fluidly sealing the cooling channel formed in the cooling section
Data Source
AI summary
A substrate support chuck for use in a substrate processing system is provided herein. In some embodiments, a substrate support for use in a substrate processing chamber may include an electrostatic chuck having a top substrate support surface and a bottom surface, and a cooling ring assembly having a central opening disposed proximate the bottom surface of the electrostatic chuck, the cooling ring assembly including, a cooling section having a top surface thermally coupled to the bottom surface of the electrostatic chuck, the cooling section having a cooling channel formed in a bottom surface of the cooling section, and a cap coupled to a bottom surface of the cooling section and fluidly sealing the cooling channel formed in the cooling section.