Electrostatic Chuck Bonding for Cryogenic Temperature Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate fixing devices face issues with non-uniform temperature distribution on the adsorption face of electrostatic adsorption members due to cohesive failure of the adhesive layer, particularly at low temperatures, leading to variations in thermal resistance.
Innovation Solution
The substrate fixing device incorporates an adhesive layer with a storage modulus between 0.01 MPa and 25 MPa within a temperature range of −110° C. to 250° C., and an auxiliary adhesive layer with higher storage modulus at specific temperature ranges, to suppress cohesive failure and enhance thermal uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional adhesive layer is used to bond the electrostatic adsorption member to the base plate, then the device structure is simple and easy to manufacture, but the temperature uniformity on the adsorption face deteriorates due to cohesive failure of the adhesive layer at low temperatures
Solution Approach 1:
The patent applies parameter changes by specifying the storage modulus of the adhesive layer must be between 0.01 MPa and 25 MPa across a temperature range of -110°C to 250°C. This parameter control prevents cohesive failure at low temperatures while maintaining bonding functionality, thereby improving temperature uniformity on the adsorption face without fundamentally changing the adhesive layer structure
Solution Approach 2:
The patent introduces an auxiliary adhesive layer that provides dynamic support to the first adhesive layer. The auxiliary adhesive layer has higher storage modulus characteristics that compensate for the first adhesive layer's softness at low temperatures, preventing cohesive failure dynamically across the operating temperature range while maintaining the overall bonding structure
2Reliability
If the adhesive layer is made softer to reduce stress at low temperatures, then cohesive failure is suppressed, but the bonding strength and structural stability deteriorate
Solution Approach 1:
The patent segments the adhesive system into two distinct layers: a first adhesive layer with low storage modulus (0.01-25 MPa) that provides stress relief and prevents cohesive failure, and an auxiliary adhesive layer with higher storage modulus that provides bonding strength and structural stability. This segmentation allows each layer to perform its specialized function without compromising the other
Solution Approach 2:
The patent creates a composite adhesive structure by combining two adhesive layers with different mechanical properties. The first adhesive layer (softer) and auxiliary adhesive layer (stiffer) work together as a composite system, where the softer layer prevents cohesive failure through stress distribution while the stiffer layer maintains bonding strength, achieving both reliability and strength simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress on the adhesive layer, minimizing cohesive failure and achieving improved thermal uniformity on the adsorption face of the electrostatic adsorption member, even at varying temperatures.
Implementation Method 1
an adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate
Data Source
AI summary
A substrate fixing device includes: a base plate; an electrostatic adsorption member that adsorbs and holds a substrate; and a first adhesive layer that adhesively bonds the electrostatic adsorption member to the base plate. A storage modulus of the first adhesive layer is not less than 0.01 MPa and not more than 25 MPa within a temperature range of −110° C. to 250° C.