Electrostatic Chuck Self-Cleaning for Etch Debris Removal

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Solution Overview

Problem

The frequent formation of debris particles and contamination on the substrate chuck surface in semiconductor process chambers leads to inefficiencies in heat transfer and substrate cooling, necessitating frequent and time-consuming manual cleaning, resulting in downtime for the apparatus.

Innovation Solution

The implementation of a self-cleaning etching apparatus that utilizes negative voltage or radio frequency pulses to charge debris particles and contaminants, allowing them to attach to a positively charged surface, such as a dummy substrate with an adhesive coating, facilitating their removal without interrupting the process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If manual cleaning operations are performed frequently to remove debris particles and contamination from the substrate chuck surface, then the cleanliness and temperature control of the substrate is maintained, but the apparatus experiences substantial downtime and increased operational costs

Engineering Contradiction:

Improvetemperature controlVSAvoiddowntime

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The system employs an electrostatic chuck that automatically captures debris particles and contamination through electrostatic attraction during normal operation, eliminating the need for frequent manual cleaning interventions while maintaining temperature control and cleanliness

Inventive Principle:

Principle #25Self-service

2Productivity

If the substrate chuck operates continuously without cleaning, then productivity is maintained, but debris particles and contamination accumulate on the surface causing heat transfer gas leakage and reduced temperature control efficiency

Engineering Contradiction:

Improvecontinuous operationVSAvoidtemperature control

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The electrostatic chuck continuously captures debris particles and contamination during operation through electrostatic attraction, enabling uninterrupted productivity while maintaining temperature control efficiency without requiring shutdowns for cleaning

Inventive Principle:

Principle #25Self-service

3Strength

If mechanical clamp rings are used to hold the substrate, then the substrate is securely affixed, but particles are generated through abrasion leading to contamination and frequent cleaning requirements

Engineering Contradiction:

Improvesubstrate holdingVSAvoidparticle contamination

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The system replaces mechanical clamp rings with an electrostatic chuck that uses electrostatic fields to hold the substrate, eliminating mechanical contact and abrasion-generated particles while maintaining secure substrate affixation

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively reduces downtime for cleaning operations, maintains proper temperature control, and enhances the efficiency of substrate cooling by continuously removing debris and contamination, thereby improving device yield and reducing manual cleaning needs.

Implementation Method 1

an electrostatic chuck (ESC) can be used to hold the substrate during the plasma processes

Methodology Applied

Scientific EffectElectrostatic force: Electrostatics

Implementation Method 2

applying a plasma, thereby creating a positively charged surface on the surface of the substrate

Methodology Applied

Scientific EffectPlasma: Plasma

Implementation Method 3

causing the debris particles and contaminants to be attracted to and attach to the positively charged surface of the substrate

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 4

applying a negative voltage or a radio frequency pulse to the electrode chuck, thereby making debris particles and contaminants on, and/or in proximity, of the surface of the electrostatic chuck negatively charged

Methodology Applied

Scientific EffectRadio frequency pulse:

Data Source

PatentUS20240355663A1Etching apparatus and methods of cleaning thereof

Publication Date: 2024.10.24 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method for cleaning debris and contamination from an etching apparatus is provided. The etching apparatus includes a process chamber, a source of radio frequency power, an electrostatic chuck within the process chamber, a chuck electrode, and a source of DC power connected to the chuck electrode. The method of cleaning includes placing a substrate on a surface of the electrostatic chuck, applying a plasma to the substrate, thereby creating a positively charged surface on the surface of the substrate, applying a negative voltage or a radio frequency pulse to the electrode chuck, thereby making debris particles and/or contaminants from the surface of the electrostatic chuck negatively charged and causing them to attach to the positively charged surface of the substrate, and removing the substrate from the etching apparatus thereby removing the debris particles and/or contaminants from the etching apparatus.