Electrostatic Chuck Dielectric Layer for Higher Adhesion and Lifespan
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Solution Overview
Problem
Conventional electrostatic chucks used in substrate processing have poor voltage resistance characteristics, short lifespan, and reduced attractive force due to void formation during plasma spraying, leading to decreased adhesion and precision issues, especially when masks are in close contact with substrates.
Innovation Solution
The electrostatic chuck employs a dielectric layer formed using a sol-gel method to reduce porosity and increase the dielectric constant, combined with plasma spraying, and incorporates a magnetic force to ensure close contact between the mask and substrate, along with an edge support portion to prevent particle entry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the dielectric layer and electrodes are formed through plasma spraying method, then the manufacturing cost is reduced and large-area substrates can be processed, but the voltage resistance characteristic is poor due to void formation, the life is short, and the attractive force is lowered
Solution Approach 1:
The patent changes the manufacturing method from plasma spraying to sol-gel process, which fundamentally alters the formation parameters of the dielectric layer. The sol-gel method produces a denser, more uniform dielectric layer without voids, thereby improving voltage resistance and attractive force while maintaining manufacturing feasibility
Solution Approach 2:
The patent replaces the plasma spraying process with a chemical sol-gel process. This substitution eliminates the mechanical/physical deposition issues of plasma spraying that cause void formation, achieving better electrical characteristics through a chemical transformation approach
2Manufacturing precision
If the substrate is in close contact with the bottom surface of the carrier, then the processing is performed in a controlled state, but the degree of adhesion of the substrate and the mask is lowered due to sagging of the mask, which makes it difficult to process the substrate precisely
Solution Approach 1:
The patent applies magnetic force locally at specific positions to compensate for mask sagging. By positioning magnets strategically, the system creates localized adhesive forces that counteract the sagging effect in critical areas, maintaining mask-substrate adhesion where precision is most needed
Solution Approach 2:
The patent introduces a magnetic field-based system to replace purely mechanical contact adhesion. The magnetic force provides an additional holding mechanism that prevents mask sagging while maintaining close contact, solving the adhesion problem without sacrificing processing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly increases substrate adhesion, prolongs the electrostatic chuck's maintenance cycle, improves attraction force, and enhances processing uniformity and precision by maintaining close contact between the mask and substrate.
Implementation Method 1
by forming the dielectric layer of the electrostatic chuck through a sol-gel method, the porosity of the dielectric layer is lowered
Implementation Method 2
an electrostatic chuck for fixing a substrate by an electrostatic force
Implementation Method 3
a dielectric layer formed using a sol-gel method to reduce porosity and increase the dielectric constant, combined with plasma spraying
Implementation Method 4
incorporates a magnetic force to ensure close contact between the mask and substrate
Implementation Method 5
combined with plasma spraying
Data Source
AI summary
The present invention relates to a method for manufacturing an electrostatic chuck comprising: a base member of a metal material; and a dielectric layer, formed on an upper surface of the base member, including an electrode layer to the inside of which a DC power is applied. According to the present invention, the dielectric layer is formed of a ceramic material by using at least one selected from among a plasma spraying method and a sol-gel method, and thus can be provided with low porosity to increase in lifespan, and with high permittivity to increase in adhesion force to a substrate.