Electrostatic Chuck Coating for High-Voltage Dielectric Strength
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Solution Overview
Problem
Dielectric breakdown in electrostatic chucks used in semiconductor manufacturing is a critical concern due to high voltage applications, high temperatures, and hostile environments, leading to operational failures and material degradation.
Innovation Solution
A coated substrate for electrostatic chucks is developed, comprising a cooling base, metal portion, high strength dielectric portion, and clamping layer, formed through atmospheric and suspension plasma spray processes, with a textured clamping surface, using materials like Yttria and aluminum oxide to withstand higher voltages and temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric material is used in high voltage applications, then the substrate can maintain insulating properties, but the dielectric material is subject to breakdown at high voltages
Solution Approach 1:
The patent applies composite materials by combining multiple dielectric layers with different properties. The first dielectric layer (e.g., alumina) provides base insulation, while the second dielectric layer (e.g., aluminum oxide) provides enhanced breakdown strength. This composite structure allows the substrate to maintain insulating properties while withstanding higher voltages than a single material could provide.
2Strength
If the dielectric material thickness is increased to withstand higher voltages, then breakdown strength improves, but the substrate size and complexity increase
Solution Approach 1:
The patent segments the dielectric structure into multiple distinct layers, each with specific thicknesses and material compositions. The first dielectric layer has a first thickness and the second dielectric layer has a second thickness, allowing the total breakdown strength to be achieved through layered construction rather than a single thick layer, thereby managing complexity through modular design.
3Ease of manufacture
If conventional dielectric materials are used, then manufacturing is simpler, but the materials degrade at high temperatures and hostile environments
Solution Approach 1:
The patent changes the material parameters by selecting specific dielectric materials (such as alumina and aluminum oxide) that have high thermal stability and resistance to hostile environments. These materials maintain their insulating properties at elevated temperatures where conventional dielectrics would degrade, thereby improving reliability without significantly complicating the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coated substrate enhances dielectric strength, allowing chucking voltages up to 5000 VDC and withstands high temperatures, reducing the risk of breakdown and ensuring reliable wafer holding in semiconductor processes.
Implementation Method 1
The substrate and/or the first dielectric layer are then subjected to a plasma spray process to form a coating on the substrate and/or the first dielectric layer
Implementation Method 2
ESCs are used extensively in semiconductor manufacturing and other precision applications to hold wafers or other substrates in place using electrostatic forces
Data Source
AI summary
A substrate configured to withstand a high electrical voltage. The substrate comprises a functional electrical layer formed on the substrate using either atmospheric plasma spray (APS) suspension plasma spray (SPS). A high strength dielectric material is coated onto the functional electrical layer using SPS. A clamping layer is coated on the high strength dielectric material using either APS or SPS.