Electrostatic Chuck Dielectric Repair via Plasma Spraying
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Solution Overview
Problem
Electrostatic chucks used in semiconductor manufacturing become ineffective due to worn-down mesas and compromised dielectric materials, leading to premature discard and high replacement costs.
Innovation Solution
A method involving the removal of a predetermined amount of material to expose a base surface, roughening, and plasma spraying of new dielectric material to form mesas, with selective removal and polishing to restore the chuck's functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the electrostatic chuck is used continuously for processing, then productivity is improved, but the dielectric material deteriorates and mesas wear down
Solution Approach 1:
The patent applies the discarding and recovering principle by refurbishing the electrostatic chuck through removing degraded dielectric material and replacing it with new dielectric material. This process recovers the chuck's functionality without discarding the entire component, thus extending its service life while maintaining productivity.
2Reliability
If the electrostatic chuck is discarded when mesas wear down or dielectric cracks form, then reliability is maintained, but loss of substance and cost increase
Solution Approach 1:
Instead of discarding the entire electrostatic chuck when dielectric material degrades, the patent recovers valuable components by selectively removing only the degraded dielectric layers and replacing them. This reduces material waste while maintaining reliability.
Solution Approach 2:
The patent segments the electrostatic chuck into replaceable dielectric layers and a reusable base structure. By dividing the chuck into these functional segments, only the degraded dielectric material needs replacement rather than the entire assembly, reducing waste and cost.
3Ease of repair
If new dielectric material is applied over degraded material, then ease of repair is improved, but manufacturing precision deteriorates due to uneven surfaces
Solution Approach 1:
The patent applies preliminary action by thoroughly preparing the base surface through roughening and coating processes before applying new dielectric material. This pre-treatment ensures proper adhesion and creates a uniform foundation, preventing surface irregularities that would compromise manufacturing precision.
Solution Approach 2:
The patent uses plasma spraying (a pneumatic process) to deposit new dielectric material onto the prepared surface. This method enables uniform coating application that compensates for minor surface variations, maintaining manufacturing precision while facilitating easy repair.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The refurbished electrostatic chuck maintains similar resistivity and functionality to new chucks at a lower cost, extending the life of existing equipment and reducing waste.
Implementation Method 1
the base surface is roughened to enhance the adherence of new dielectric material thereto
Implementation Method 2
plasma spraying dielectric material onto the roughened base surface to form a dielectric layer of sprayed material on the base surface
Implementation Method 3
The electrostatic chuck permits that substrate to remain in a fixed location on the electrostatic chuck during processing by electrostatically clamping the substrate to the chuck
Data Source
AI summary
The present invention generally relates to a refurbished electrostatic chuck and a method of refurbishing a used electrostatic chuck. Initially, a predetermined amount of dielectric material is removed from the used electrostatic chuck to leave a base surface. Then, the base surface is roughened to enhance the adherence of new dielectric material thereto. The new dielectric material is then sprayed onto the roughened surface. A mask is then placed over the new dielectric material to aid in the formation of mesas upon which a substrate will sit during processing. A portion of the new dielectric layer is then removed to form new mesas. After removing the mask, edges of the mesas may be smoothed and the refurbished electrostatic chuck is ready to return to service after cleaning.